Patents by Inventor Patrick Griffin Quigley

Patrick Griffin Quigley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Clad casing for laptop computers and the like
    Patent number: 6253838
    Abstract: Disclosed is a casing for an electronic device which includes a heat dissipation layer, inner and outer insulative layers along either side of the heat dissipation layer, and a heat pipe which has a portion in thermal-transfer contact with the heat dissipation layer. The heat dissipation layer has a thermal conductivity in a first range whereas the insulative layers have a thermal conductivity in a different, lower range. Preferably, the inner layer is either thicker than the outer layer, has a lower thermal conductivity than the outer layer, or both. Vent holes can be provided through the heat dissipation layer, and, if so, the holes are preferably covered by either the inner or outer layers. Only a portion of the casing need have the foregoing heat dissipation layer, inner and outer insulative layers, and heat pipe.
    Type: Grant
    Filed: June 13, 2000
    Date of Patent: July 3, 2001
    Assignee: Applied Thermal Technology
    Inventors: Frederick Charles Fiechter, Patrick Griffin Quigley
  • Clad casting for laptop computers and the like
    Patent number: 6073684
    Abstract: Disclosed is a casing for an electronic device which includes a heat dissipation layer, inner and outer insulative layers along either side of the heat dissipation layer, and a heat pipe which has a portion in thermal-transfer contact with the heat dissipation layer. The heat dissipation layer has a thermal conductivity in a first range whereas the insulative layers have a thermal conductivity in a different, lower range. Preferably, the inner layer is either thicker than the outer layer, has a lower thermal conductivity than the outer layer, or both. Vent holes can be provided through the heat dissipation layer, and, if so, the holes are preferably covered by either the inner or outer layers. Only a portion of the casing need have the foregoing heat dissipation layer, inner and outer insulative layers, and heat pipe.
    Type: Grant
    Filed: February 23, 1998
    Date of Patent: June 13, 2000
    Assignee: Applied Thermal Technology
    Inventors: Frederick Charles Fiechter, Patrick Griffin Quigley