Abstract: A ball grid array socket with rows of electrical contacts that extend through holes in a plate. The arrangement of the holes and the electrical contacts provides an entry hole. The contacts are arranged with ends that are cupped to mate with the side and top of the ball contacts of the ball grid array package. The contact surface of the ball grid array package is vertically inserted without any interfering structure. The plate is spring loaded is such a way that the plate is driven parallel to the plane of the ball contacts in a manner that reduces the entry hole opening. This reduced entry opening is arranged and constructed such that with a ball contact insert therein electrical conductivity is provided between the ball contact and the electrical contact, and further where the cupped ends of the electrical contact retain the ball within the hole. The edges of the hole and the top of the cupped electrical contact are chamfered to mate with the curved sides of the ball contact.

Abstract: An aligning socket for an IC that provides an aligning bar that aligns and secures IC leads to the corresponding socket contacts (6), and where the bar has extensions or ears (42) that extend toward the row of IC leads (38). The ears have chamfered edges that, as the bar is forced toward the IC leads, guide the IC leads to mate with the socket contacts. For more fragile gull-winged leads, a rail 18 is provided to support the under side of the leads and the alignment bar ears are designed to fit over the ends of the rail. When the bar and socket contacts are forced toward the IC leads, the bar ears overlap the ends of the rail and force any mis-aligned IC leads to move such that alignment of the leads and the socket contacts is achieved.

Abstract: A system for protecting a gull-wing IC providing a carrier (5) that mates to a programming socket (21) and to a development socket (40). The IC need not be removed from carrier throughout the handling, test/burn-in, programming, and final assembly on the PC board. Moreover, the footprint of the output electrical contacts on the development socket match the footprint of the IC leads, so that the etched PC board pads will accept the IC leads or the development socket output contacts, wherein the assembler may mount the IC using the carrier and the SMT socket or not.

Abstract: Freshly cut tobacco leaves are processed wherein the processing includes particle size reduction and drying immediately upon harvesting.