Patents by Inventor Patrick H. O'Neill

Patrick H. O'Neill has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metal constrained circuit board side to side interconnection technique
    Patent number: 5819401
    Abstract: A method of constructing a printed circuit board module and the module which comprises providing a substrate core having a first aperture extending therethrough and a pair of printed circuit boards, each board having at least one electrically conductive layer, secured to the substrate core and having a second aperture therethrough aligned with the first aperture. An electrically conductive member having an electrically insulating member is disposed around the electrically conductive member. The electrically conductive member having an electrically insulating member disposed therearound is positioned so that the electrically insulating member is disposed in the first aperture and the electrically conductive member extends into the second aperture of each of the printed circuit boards. The printed circuit boards are secured to the substrate core to lock the electrically insulating member in the first aperture.
    Type: Grant
    Filed: April 24, 1997
    Date of Patent: October 13, 1998
    Assignee: Texas Instruments Incorporated
    Inventors: William R. Johannes, Patrick H. O'Neill, David M. Mendez