Patents by Inventor Patrick Harney

Patrick Harney has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • E-mail response time estimation on compose or send
    Patent number: 8452840
    Abstract: An e-mail application calculates a dynamic estimate of an e-mail response time. A recipient address module, a status module, a processing module, and a presentation module interact to generate a first and a second estimated response time. The first estimated response time is determined from sender side data. The second estimated response time is generated using recipient mailbox status data after the e-mail is received by the recipient. The second estimated response time is used to dynamically update the estimated response time displayed to the sender.
    Type: Grant
    Filed: July 21, 2008
    Date of Patent: May 28, 2013
    Assignee: International Business Machines Corporation
    Inventors: Jos Manuel Accapadi, Patrick Harney
  • E-Mail Response Time Estimation on Compose or Send
    Publication number: 20100017484
    Abstract: An e-mail application calculates a dynamic estimate of an e-mail response time. A recipient address module, a status module, a processing module, and a presentation module interact to generate a first and a second estimated response time. The first estimated response time is determined from sender side data. The second estimated response time is generated using recipient mailbox status data after the e-mail is received by the recipient. The second estimated response time is used to dynamically update the estimated response time displayed to the sender.
    Type: Application
    Filed: July 21, 2008
    Publication date: January 21, 2010
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jos Manuel Accapadi, Patrick Harney
  • Active alignment as an integral part of optical package design
    Patent number: 6825744
    Abstract: A microstructure package and a method of assembling such a package are described. A package base provides an outer body of the package and has an internal cavity. A device die is located within the cavity, and a flexible die paddle connects the base and the die. The paddle is immovably fixed to hold the die in a highly precise position relative to the base.
    Type: Grant
    Filed: April 29, 2002
    Date of Patent: November 30, 2004
    Assignee: Analog Devices, Inc.
    Inventor: Kieran Patrick Harney
  • Active alignment as an integral part of optical package design
    Publication number: 20030201856
    Abstract: A microstructure package and a method of assembling such a package are described. A package base provides an outer body of the package and has an internal cavity. A device die is located within the cavity, and a flexible die paddle connects the base and the die. The paddle is immovably fixed to hold the die in a highly precise position relative to the base.
    Type: Application
    Filed: April 29, 2002
    Publication date: October 30, 2003
    Inventor: Kieran Patrick Harney