Abstract: A device for thermally loading an enclosure and/or a heat sink includes: at least one circuit board arranged or arrangeable in the enclosure or on the heat sink, each at least one circuit board having at least one conductor track and at least two fields within each of which a continuous electrically conductive track section of the at least one conductor track runs, a path length of the at least one conductor track section within each of the at least two fields being greater than one or each edge length of a respective field or one or each diagonal of the respective field or a perimeter of the respective field. The fields include tiles of a tiling of a first side of the circuit board The conductor track sections each thermally load the enclosure and/or the heat sink depending on a current feed to the respective conductor track.

Abstract: A process for treating a substrate, being a fabric or leather, where an homogenous mixture of particles based on a maleimide polymer comprising a thermo-regulator additive is applied to a substrate and subsequently dried on it.