Patents by Inventor Patrick Henry Harper

Patrick Henry Harper has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-site chip carrier and method
    Patent number: 7108517
    Abstract: An integrated circuit (IC) package socket device that can receive two or more IC packages and the method of operating the device. Uses for the device include burn-in in which testing and programming of dies or completed IC packages. The device can also be arranged to receive two or more types of IC packages. A pressure unit is tiltably attached to the lid of the socket device providing a resilient normal force to each of the two or more IC packages without damaging the IC packages. The pressure unit has two or more pressure pads that correspondingly apply the resilient normal force to each of the two or more IC packages. The IC packages are received in recesses where the recesses are typically arranged in an array with the pressure pads in the pressure unit arranged so as to align with the array of recesses.
    Type: Grant
    Filed: September 27, 2004
    Date of Patent: September 19, 2006
    Assignee: Wells-CTI, LLC
    Inventor: Patrick Henry Harper
  • Multi-site chip carrier and method
    Publication number: 20060068614
    Abstract: An integrated circuit (IC) package socket device that can receive two or more IC packages and the method of operating the device. Uses for the device include burn-in in which testing and programming of dies or completed IC packages. The device can also be arranged to receive two or more types of IC packages. A pressure unit is tiltably attached to the lid of the socket device providing a resilient normal force to each of the two or more IC packages without damaging the IC packages. The pressure unit has two or more pressure pads that correspondingly apply the resilient normal force to each of the two or more IC packages. The IC packages are received in recesses where the recesses are typically arranged in an array with the pressure pads in the pressure unit arranged so as to align with the array of recesses.
    Type: Application
    Filed: September 27, 2004
    Publication date: March 30, 2006
    Applicant: WELLS-CTI, LLC, an Oregon limited liability company
    Inventor: Patrick Henry Harper