Patents by Inventor Patrick Houben

Patrick Houben has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240098957
    Abstract: The present disclosure relates to a cooling stage for cooling down a heated carrier on which a plurality of components has been mounted. Further aspects of the present disclosure relate to a pick-and-place apparatus that includes such a cooling stage and to a method for cooling down a heated carrier on which a plurality of components has been mounted. The cooling stage according to an aspect of the present disclosure uses supporting members for keeping the heated carrier separated from a cooling body. By relying on thermal convection between the heated carrier and the cooling body, dependency of the cooling stage on the type of carrier used is reduced compared to known cooling stages. For example, for different types of carries, it generally suffices to use different supporting members, e.g. having a different height, and/or to use a different temperature of the cooling body.
    Type: Application
    Filed: September 14, 2023
    Publication date: March 21, 2024
    Applicant: NEXPERIA B.V.
    Inventors: Arne de Roest, Roland Hanegraaf, Patrick Houben
  • Publication number: 20230260819
    Abstract: An apparatus for transferring a semiconductor die from an arrangement dies to a target is provided and relates to a wafer stage, and film frame carrier, and to an assembly including the film frame carrier and arrangement of dies. The wafer chuck includes a rotationally mounted curved shell on which the arrangement of semiconductor dies can be arranged. The wafer stage includes a motor for rotating the curved shell around a rotational axis. The configuration allows improved throughput of the wafer stage. The carrier used with this wafer stage includes a ring-shaped body with an asymmetric bending stiffness allowing the ring-shaped body to be bent so that the mounting surface of the ring-shaped body changes from a first shape to a second more concave shape and prevents or limits the ring-shaped body to be bent so that the mounting surface becomes more convex than the first shape.
    Type: Application
    Filed: February 15, 2023
    Publication date: August 17, 2023
    Applicant: NEXPERIA B.V.
    Inventors: Joep Stokkermans, Gijs van der Veen, Jasper Wesselingh, Patrick Houben
  • Publication number: 20230260954
    Abstract: The disclosure relates to an apparatus for transferring a semiconductor die from an arrangement of semiconductor dies to a target and to a wafer stage to be used in such an apparatus. The wafer chuck includes a rotationally mounted curved shell on which the arrangement of semiconductor dies can be arranged, and the wafer stage includes a first motor for rotating the curved shell around a rotational axis. The curved configuration allows an improved throughput of the wafer stage. The film frame carrier used with this wafer stage comprises a ring-shaped body with an asymmetric bending stiffness allowing the ring-shaped body to be bent so that the mounting surface of the ring-shaped body changes from having a first shape to a second more concave shape and prevents or limits the ring-shaped body to be bent so that the shape of the mounting surface becomes more convex than the first shape.
    Type: Application
    Filed: February 15, 2023
    Publication date: August 17, 2023
    Applicant: NEXPERIA B.V.
    Inventors: Joep Stokkermans, Gijs van der Veen, Jasper Wesselingh, Patrick Houben