Patents by Inventor Patrick J. Bell

Patrick J. Bell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sleeved coaxial printed circuit board vias
    Patent number: 10375838
    Abstract: A printed circuit board, and a method of fabricating the printed circuit board is disclosed. The printed circuit board includes at least one coaxial via. A hollow via is disposed in the printed circuit board. A metal sleeve is formed around the circumference of said hollow via. An inner conductive path is disposed in the hollow via. Additionally, an insulating material is disposed in the hollow via, between the conducting path and the metal sleeve. The conductive path is used to connect signal traces disposed on two different layers of the printed circuit board. In some embodiments, these signal traces carry signals having a frequency above 1 GHz, although the disclosure is not limited to this embodiment.
    Type: Grant
    Filed: March 15, 2017
    Date of Patent: August 6, 2019
    Assignee: Massachusetts Institute of Technology
    Inventors: Glenn A. Brigham, Richard J. Stanley, Bradley Thomas Perry, Patrick J. Bell
  • Sleeved Coaxial Printed Circuit Board Vias
    Publication number: 20170208695
    Abstract: A printed circuit board, and a method of fabricating the printed circuit board is disclosed. The printed circuit board includes at least one coaxial via. A hollow via is disposed in the printed circuit board. A metal sleeve is formed around the circumference of said hollow via. An inner conductive path is disposed in the hollow via. Additionally, an insulating material is disposed in the hollow via, between the conducting path and the metal sleeve. The conductive path is used to connect signal traces disposed on two different layers of the printed circuit board. In some embodiments, these signal traces carry signals having a frequency above 1 GHz, although the disclosure is not limited to this embodiment.
    Type: Application
    Filed: March 15, 2017
    Publication date: July 20, 2017
    Inventors: Glenn A. Brigham, Richard J. Stanley, Bradley Thomas Perry, Patrick J. Bell
  • Sleeved coaxial printed circuit board vias
    Patent number: 9635761
    Abstract: A printed circuit board, and a method of fabricating the printed circuit board is disclosed. The printed circuit board includes at least one coaxial via. A hollow via is disposed in the printed circuit board. A metal sleeve is formed around the circumference of said hollow via. An inner conductive path is disposed in the hollow via. Additionally, an insulating material is disposed in the hollow via, between the conducting path and the metal sleeve. The conductive path is used to connect signal traces disposed on two different layers of the printed circuit board. In some embodiments, these signal traces carry signals having a frequency above 1 GHz, although the disclosure is not limited to this embodiment.
    Type: Grant
    Filed: June 17, 2014
    Date of Patent: April 25, 2017
    Assignee: Massachusetts Institute of Technology
    Inventors: Glenn A. Brigham, Richard J. Stanley, Bradley Thomas Perry, Patrick J. Bell
  • Sleeved Coaxial Printed Circuit Board Vias
    Publication number: 20150014045
    Abstract: A printed circuit board, and a method of fabricating the printed circuit board is disclosed. The printed circuit board includes at least one coaxial via. A hollow via is disposed in the printed circuit board. A metal sleeve is formed around the circumference of said hollow via. An inner conductive path is disposed in the hollow via. Additionally, an insulating material is disposed in the hollow via, between the conducting path and the metal sleeve. The conductive path is used to connect signal traces disposed on two different layers of the printed circuit board. In some embodiments, these signal traces carry signals having a frequency above 1 GHz, although the disclosure is not limited to this embodiment.
    Type: Application
    Filed: June 17, 2014
    Publication date: January 15, 2015
    Inventors: Glenn A. Brigham, Richard J. Stanley, Bradley Thomas Perry, Patrick J. Bell