Abstract: A structural assembly for an electric vehicle includes a vehicle frame and a battery structure. The vehicle frame is distinct from a vehicle body and includes a front section, a rear section and a mid-section disposed between the front and rear sections. The mid-section includes opposed longitudinal rails. The battery structure is configured to house power storage units and is disposed between the opposed longitudinal rails. The battery structure includes a battery housing secured to the opposed longitudinal rails of the mid-section. The mid-section and the battery housing are combined into a unitized structure that is removably secured to the front and rear sections of the vehicle frame.

Abstract: A structural assembly for an electric vehicle includes a vehicle frame, a battery structure, a pair of mounting structures, and a plurality of fasteners. The vehicle frame includes opposed longitudinal rails. The battery structure is disposed between the opposed longitudinal rails and includes a battery housing configured to house power storage units. Each mounting structure is secured to a respective side of the battery housing and supports a corresponding longitudinal rail. The plurality of fasteners extend through a corresponding mounting structure of the pair of mounting structures and a corresponding longitudinal rail of the opposed longitudinal rails to secure the vehicle frame and the battery structure to each other. An outer periphery of the corresponding mounting structure is substantially flush with an outer periphery of the corresponding longitudinal rail.

Abstract: A printed circuit board, and a method of fabricating the printed circuit board is disclosed. The printed circuit board includes at least one coaxial via. A hollow via is disposed in the printed circuit board. A metal sleeve is formed around the circumference of said hollow via. An inner conductive path is disposed in the hollow via. Additionally, an insulating material is disposed in the hollow via, between the conducting path and the metal sleeve. The conductive path is used to connect signal traces disposed on two different layers of the printed circuit board. In some embodiments, these signal traces carry signals having a frequency above 1 GHz, although the disclosure is not limited to this embodiment.

Abstract: A printed circuit board, and a method of fabricating the printed circuit board is disclosed. The printed circuit board includes at least one coaxial via. A hollow via is disposed in the printed circuit board. A metal sleeve is formed around the circumference of said hollow via. An inner conductive path is disposed in the hollow via. Additionally, an insulating material is disposed in the hollow via, between the conducting path and the metal sleeve. The conductive path is used to connect signal traces disposed on two different layers of the printed circuit board. In some embodiments, these signal traces carry signals having a frequency above 1 GHz, although the disclosure is not limited to this embodiment.

Abstract: A printed circuit board, and a method of fabricating the printed circuit board is disclosed. The printed circuit board includes at least one coaxial via. A hollow via is disposed in the printed circuit board. A metal sleeve is formed around the circumference of said hollow via. An inner conductive path is disposed in the hollow via. Additionally, an insulating material is disposed in the hollow via, between the conducting path and the metal sleeve. The conductive path is used to connect signal traces disposed on two different layers of the printed circuit board. In some embodiments, these signal traces carry signals having a frequency above 1 GHz, although the disclosure is not limited to this embodiment.

Abstract: A printed circuit board, and a method of fabricating the printed circuit board is disclosed. The printed circuit board includes at least one coaxial via. A hollow via is disposed in the printed circuit board. A metal sleeve is formed around the circumference of said hollow via. An inner conductive path is disposed in the hollow via. Additionally, an insulating material is disposed in the hollow via, between the conducting path and the metal sleeve. The conductive path is used to connect signal traces disposed on two different layers of the printed circuit board. In some embodiments, these signal traces carry signals having a frequency above 1 GHz, although the disclosure is not limited to this embodiment.