Patents by Inventor Patrick J. Biel

Patrick J. Biel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8291856
    Abstract: A method and system for depositing a thin film on a substrate using a vapor deposition process is described. The processing system comprises a gas heating device for heating one or more constituents of a film forming composition. The gas heating device comprises one or more resistive heating elements configured to receive an electrical current from one or more power sources. Additionally, the gas heating device comprises a mounting structure configured to support the one or more resistive heating elements. Furthermore, the gas heating device comprises one or more static mounting devices coupled to the mounting structure and configured to fixedly couple the one or more resistive heating elements to the mounting structure, and one or more dynamic mounting devices coupled to the mounting structure and configured to automatically compensate for changes in a length of each of the one or more resistive heating elements.
    Type: Grant
    Filed: March 7, 2008
    Date of Patent: October 23, 2012
    Assignee: Tokyo Electron Limited
    Inventors: Ronald Nasman, Patrick J. Biel, Jacques Faguet
  • Publication number: 20090223452
    Abstract: A method and system for depositing a thin film on a substrate using a vapor deposition process is described. The processing system comprises a gas heating device for heating one or more constituents of a film forming composition. The gas heating device comprises one or more resistive heating elements configured to receive an electrical current from one or more power sources. Additionally, the gas heating device comprises a mounting structure configured to support the one or more resistive heating elements. Furthermore, the gas heating device comprises one or more static mounting devices coupled to the mounting structure and configured to fixedly couple the one or more resistive heating elements to the mounting structure, and one or more dynamic mounting devices coupled to the mounting structure and configured to automatically compensate for changes in a length of each of the one or more resistive heating elements.
    Type: Application
    Filed: March 7, 2008
    Publication date: September 10, 2009
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Ronald Nasman, Patrick J. Biel, Jacques Faguet