Patents by Inventor Patrick J. Case

Patrick J. Case has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Large-scale reconfigurable electronics using low cost nanoparticle ink printing method
    Patent number: 10091888
    Abstract: A method of manufacturing electronics using a nanoparticle ink printing method includes: synthesizing a phase change material (PCM) ink composition using hot injection to develop nanoparticles of the PCM; suspending the nanoparticles with a solvent; and printing a reconfigurable component using the PCM ink composition in additive manufacturing. Electronics includes: a substrate layer; an insulator layer printed on top of the substrate layer; a heater layer printed on top of the insulator layer; a barrier layer printed on top of one or more of the insulator layer and the heater layer; a phase change material (PCM) printed on top of the barrier layer; a connectivity layer printed on top of the PCM; and a passivation layer printed on top of one or more of the PCM and the connectivity layer.
    Type: Grant
    Filed: February 2, 2016
    Date of Patent: October 2, 2018
    Assignee: Northrop Grumman Systems Corporation
    Inventors: Xing Lan, Daniel R. Scherrer, Jesse B. Tice, Patrick J. Case, Xianglin Zeng
  • LARGE-SCALE RECONFIGURABLE ELECTRONICS USING LOW-COST NANOPARTICLE INK PRINTING METHOD
    Publication number: 20170223838
    Abstract: A method of manufacturing electronics using a nanoparticle ink printing method includes: synthesizing a phase change material (PCM) ink composition using hot injection to develop nanoparticles of the PCM; suspending the nanoparticles with a solvent; and printing a reconfigurable component using the PCM ink composition in additive manufacturing. Electronics includes: a substrate layer; an insulator layer printed on top of the substrate layer; a heater layer printed on top of the insulator layer; a barrier layer printed on top of one or more of the insulator layer and the heater layer; a phase change material (PCM) printed on top of the barrier layer; a connectivity layer printed on top of the PCM; and a passivation layer printed on top of one or more of the PCM and the connectivity layer.
    Type: Application
    Filed: February 2, 2016
    Publication date: August 3, 2017
    Inventors: Xing Lan, Daniel R. Scherrer, Jesse B. Tice, Patrick J. Case, Xianglin Zeng