Abstract: A PC board assembly employs an apparatus and method for securing a PC board to a base plate. Multiple compression force distributors are each attached at one end to the PC board. Each compression force distributor is preferably implemented as a compressible standoff that includes two end portions and a compressible body portion. The compressible body portion transfers a compression force applied to one end portion to the other end portion for application to the PC board. The PC board is positioned upon the base plate and the compression force is applied to the standoffs. During application of the compression force, the compressible body portions of the standoffs compress in only one direction toward the base plate, thereby distributing the compression force to the PC board to secure the board to the base plate. The method and apparatus may also be used to secure electrical components to the base plate.

Abstract: A PC board assembly employs an apparatus and method for securing a PC board to a base plate. Multiple compression force distributors are each attached at one end to the PC board. Each compression force distributor is preferably implemented as a compressible standoff that includes two end portions and a compressible body portion. The compressible body portion transfers a compression force applied to one end portion to the other end portion for application to the PC board. The PC board is positioned upon the base plate and the compression force is applied to the standoffs. During application of the compression force, the compressible body portions of the standoffs compress in only one direction toward the base plate, thereby distributing the compression force to the PC board to secure the board to the base plate. The method and apparatus may also be used to secure electrical components to the base plate.

Abstract: The solder bump apparatus includes a substantially conductive region (14) and a slot (16) projecting from the substantially conductive region (14). A solder resist region (12) at least in part surrounds a perimeter of the substantially conductive region (14) and a perimeter of the slot (16). A solder bump (22) is formed on the conductive region (14) and at least a portion of the solder resist region (12).

Abstract: Orienting air-wound coils for placement by an automatic pick-and-place machine has been a problem for small electronic coils. Extracting damaged or deformed coils on a one-by-one basis is expensive and time-consuming. A feeder for air-wound coils uses a rod (101), a track (103), and a two-segment guide (105, 107) and has built-in mechanisms for rejecting damaged coils while feeding undamaged coils (111, 113) in the proper orientation to a pick-and-place machine.