Patents by Inventor Patrick J. Schouterden
Patrick J. Schouterden has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20100317798Abstract: The invention relates to a polyethylene composition with a bimodal molecular weight distribution and articles made therefrom, such as high topload blow moldings and transmission and distribution pipes. The composition comprises a low-molecular-weight (LMW) ethylene homopolymer component and a homogeneous, high-molecular-weight (HMW) ethylene interpolymer component, wherein the LMW component is characterized as having a molecular weight distribution, MWDL, of less than about 8. The composition is characterized as having a bimodal molecular weight distribution, and a ductile-brittle transition temperature, Tdb, of less than ?20° C. In some embodiments, the HMW component is characterized by a reverse comonomer distribution.Type: ApplicationFiled: August 23, 2010Publication date: December 16, 2010Applicant: Dow Global Technologies Inc.Inventors: Jozef J. VanDun, Peter F.M. van den Berghe, Patrick J. Schouterden, Ruddy Nicasy, Johan Vanvoorden, Frederik E.I. Gemoets, Kalyan Sehanobish, Noorallah Jivraj, Ravi S. Dixit
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Patent number: 7645835Abstract: Blend compositions containing a novel homopolymer, the use of which allows the incorporation of more comonomer in the additional components of the blend (for the same overall density) resulting in increased tie molecule formation and improvement in properties such as ESCR, toughness and impact strength are disclosed. The homopolymers are important for applications where a high density is needed to ensure certain mechanical properties like abrasion resistance, indentation resistance, pressure resistance, topload resistance, modulus of elasticity, or morphology (for the chlorination of PE to CPE) and additional advantages such as melt processability. The blend can be obtained by dry or melt mixing the already produced components, or through in-situ production by in parallel and/or in series arranged reactors. These resins can be used in applications such as films, blow molded, injection molded, and rotomolded articles, fibers, and cable and wire coatings and jacketings and, various forms of pipe.Type: GrantFiled: June 21, 2006Date of Patent: January 12, 2010Assignee: Dow Global Technologies, Inc.Inventors: Jozef J. Van Dun, Akira Miyamoto, Grant B. Jacobsen, Fumio Matsushita, Patrick J. Schouterden, Lee Spencer, Pak-Wing S. Chum, Larry A. Meiske, Peter L. Wauteraerts
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Publication number: 20080161497Abstract: The invention relates to a polyethylene composition with a bimodal molecular weight distribution and articles made therefrom, such as high topload blow moldings and transmission and distribution pipes. The composition comprises a low-molecular-weight (LMW) ethylene homopolymer component and a homogeneous, high-molecular-weight (HMW) ethylene interpolymer component, wherein the LMW component is characterized as having a molecular weight distribution, MWDL, of less than about 8. The composition is characterized as having a bimodal molecular weight distribution, and a ductile-brittle transition temperature, Tdb, of less than ?20° C. In some embodiments, the HMW component is characterized by a reverse comonomer distribution.Type: ApplicationFiled: January 11, 2008Publication date: July 3, 2008Applicant: Dow Global Technologies Inc.Inventors: Jozef J. Van Dun, Patrick J. Schouterden, Kalyan Sehanobish, Peter F.M. van den Berghe, Noorallah Jivraj, Johan Vanvoorden, Ruddy Nicasy, Ravi S. Dixit, Frederik E.L. Gemoets
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Patent number: 7153909Abstract: Blend compositions containing a novel homopolymer, the use of which allows the incorporation of more comonomer in the additional components of the blend (for the same overall density) resulting in increased tie molecule formation and improvement in properties such as ESCR, toughness and impact strength are disclosed. The homopolymers are important for applications where a high density is needed to ensure certain mechanical properties like abrasion resistance, indentation resistance, pressure resistance, topload resistance, modulus of elasticity, or morphology (for the chlorination of PE to CPE) and additional advantages such as melt processability. The blend can be obtained by dry or melt mixing the already produced components, or through in-situ production by in parallel and/or in series arranged reactors. These resins can be used in applications such as films, blow molded, injection molded, and rotomolded articles, fibres, and cable and wire coatings and jacketings and, various forms of pipe.Type: GrantFiled: June 13, 2002Date of Patent: December 26, 2006Assignee: Dow Global Technologies Inc.Inventors: Jozef J. Van Dun, Akira Miyamoto, Grant B. Jacobsen, Fumio Matsushita, Patrick J. Schouterden, Lee Spencer, Pak-Wing S. Chum, Larry A. Meiski, Peter L. Wauteraerts
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Patent number: 7129296Abstract: The invention relates to a polyethylene composition with a bimodal molecular weight distribution and articles made therefrom. The composition comprises a low-molecular-weight (LMW) ethylene homopolymer component and a homogeneous, high-molecular-weight (LMW) ethylene interpolymer component, wherein the LMW component is characterized as having a molecular weight distribution, MWDL, of less than about 8. In some embodiments, the HMW component is characterized by a reverse comonomer distribution.Type: GrantFiled: April 2, 2004Date of Patent: October 31, 2006Assignee: Dow Global Technologies Inc.Inventors: Jozef J. Van Dun, Patrick J. Schouterden, Kalyan Sehanobish, Peter F. M. van den Berghen, Noorallah Jivraj, Ruddy Nicasy, Johan Vanvoorden, Ravi S. Dixit, Frederik E. Gemoets
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Publication number: 20040198911Abstract: The invention relates to a polyethylene composition with a bimodal molecular weight distribution and articles made therefrom. The composition comprises a low-molecular-weight (LMW) ethylene homopolymer component and a homogeneous, high-molecular-weight (HMW) ethylene interpolymer component, wherein the LMW component is characterized as having a molecular weight distribution, MWDL, of less than about 8. In some embodiments, the HMW component is characterized by a reverse comonomer distribution.Type: ApplicationFiled: April 2, 2004Publication date: October 7, 2004Inventors: Jozef J. Van Dun, Patrick J. Schouterden, Kalyan Sehanobish, Peter F. M. van den Berghen, Noorallah Jivraj, Ruddy Nicasy, Johan Vanvoorden, Ravi S. Dixit, Frederik E. Gemoets
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Patent number: 6787608Abstract: The invention relates to a polyethylene composition with a bimodal molecular weight distribution and articles made therefrom, such as high topload blow moldings and transmission and distribution pipes. The composition comprises a low-molecular-weight (LMW) ethylene homopolymer component and a homogeneous, high-molecular-weight (HMW) ethylene interpolymer component, wherein the LMW component is characterized as having a molecular weight distribution, MWDL, of less than about 8. The composition is characterized as having a bimodal molecular weight distribution, and a ductile-brittle transition temperature, Tdb, of less than −20° C. In some embodiments, the HMW component is characterized by a reverse comonomer distribution.Type: GrantFiled: August 16, 2002Date of Patent: September 7, 2004Assignee: Dow Global Technologies, Inc.Inventors: Jozef J. VanDun, Patrick J. Schouterden, Peter F. M. van den Berghe, Ruddy Nicasy, Johan Vanveorden, Frederick E. L. Gemoets, Kalyan Sehanobish, Noorallah Jivraj, Ravi S. Dixit
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Publication number: 20030149180Abstract: The invention relates to a polyethylene composition with a bimodal molecular weight distribution and articles made therefrom, such as high topload blow moldings and transmission and distribution pipes. The composition comprises a low-molecular-weight (LMW) ethylene homopolymer component and a homogeneous, high-molecular-weight (HMW) ethylene interpolymer component, wherein the LMW component is characterized as having a molecular weight distribution, MWDL, of less than about 8. The composition is characterized as having a bimodal molecular weight distribution, and a ductile-brittle transition temperature, Tdb, of less than −20° C. In some embodiments, the HMW component is characterized by a reverse comonomer distribution.Type: ApplicationFiled: August 16, 2002Publication date: August 7, 2003Applicant: Dow Global Technologies Inc.Inventors: Jozef J. Van Dun, Patrick J. Schouterden, Kalyan Sehanobish, Peter F.M. van den Berghe, Noorallah Jivraj, Johan Vanvoorden, Ravi S. Dixit, Ruddy Nicasy, Frederik E.L. Gemoets