Abstract: A device package comprising an integrated cooling assembly. The integrated cooling assembly comprises a first semiconductor device, a cold plate, and a second semiconductor device attached therebetween. The cold plate comprises a manifold attached to the second semiconductor device. The manifold comprising an inlet opening and an outlet opening, a support feature extending downwardly from the manifold to the first semiconductor device, and a coolant channel coupling the inlet opening and the outlet opening. The coolant channel extends through a portion of the support feature proximate to the first semiconductor device.

Abstract: An apparatus and method are presented for testing an adhesive layer formed between an integrated circuit and a plate, wherein the plate may be semiconductor device package substrate or a heat spreader. The apparatus includes a pull stud and a pull arm. The pull stud has an upper portion and a lower portion, wherein the lower portion is attached to a surface of the integrated circuit opposite the plate. The upper portion of the pull stud may be, for example, a tapered cylinder having a large end and a small end. The small end meets the lower portion of the pull stud. The pull arm has two opposed ends and at least one bracket for receiving a force. One of the pull arm ends has a "V"-shaped opening surrounded by a lip which receives the upper portion of the pull stud. During use, the lip contacts and retains the upper portion of the pull stud. The opening has an upper wall, and an upper surface of the pull stud contacts the upper wall when the upper portion of the pull stud is inserted into the opening.