Abstract: In a physical vapor deposition method of thermochemical treatment of metals, the substance of a target which constitutes a first electrode of a treatment furnace is evaporated by ion bombardment optionally assisted by an electrical arc discharge. The particles evaporated in this manner are deposited onto a substrate at the potential of a second electrode which is different from that of the first electrode. The substrate is heated during this deposition to a treatment temperature exceeding 600.degree. C. and preferably between 800.degree. C. and 1 200.degree. C. The target and its ancillary members in the furnace are continuously cooled by a flow of cooling fluid so that when the treatment temperature is reached the material of the target remains solid and the evaporation occurring at the surface of the target is effected by sublimation. The result is to improve the regularity of the deposit, its adherence to the substrate and the treatment time.

Abstract: In a physical vapor deposition method of thermochemical treatment of metals, the substance of a target which constitutes a first electrode of a treatment furnace is evaporated by ion bombardment optionally assisted by an electrical arc discharge. The particles evaporated in this manner are deposited onto a substrate at the potential of a second electrode which is different from that of the first electrode. The substrate is heated during this deposition to a treatment temperature exceeding 600.degree. C. and preferably between 800.degree. C. and 1,200.degree. C. The target and its ancillary members in the furnace are continuously cooled by a flow of cooling fluid so that when the treatment temperature is reached the material of the target remains solid and the evaporation occurring at the surface of the target is effected by sublimation. The result is to improve the regularity of the deposit, its adherence to the substrate and the treatment time.