Patents by Inventor Patrick John Meehan

Patrick John Meehan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Vertical magnetic barrier for integrated electronic module and related methods
    Patent number: 9986639
    Abstract: An integrated electronic component assembly can include an electrically-conductive structure comprising two or more electrically-conductive terminals accessible on an exterior of the integrated electronic component assembly, a first component attachment region for a first component within the integrated electronic component assembly, and a second component attachment region for a second component within the integrated electronic component assembly. The integrated electronic component assembly can include an electrically-conductive magnetically-permeable shield coupled to or defined by the electrically-conductive structure, the electrically-conductive magnetically-permeable shield located between the first and second component attachment regions, including a portion extending in a direction out of a plane defined by the first and second component attachment regions, to suppress magnetic coupling between the first and second components.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: May 29, 2018
    Assignee: Analog Devices Global
    Inventors: Aldrick S. Limjoco, Michael Cusack, Donal G. O'Sullivan, Patrick John Meehan, Thomas Conway
  • VERTICAL MAGNETIC BARRIER FOR INTEGRATED ELECTRONIC MODULE
    Publication number: 20160380606
    Abstract: An integrated electronic component assembly can include an electrically-conductive structure comprising two or more electrically-conductive terminals accessible on an exterior of the integrated electronic component assembly, a first component attachment region for a first component within the integrated electronic component assembly, and a second component attachment region for a second component within the integrated electronic component assembly. The integrated electronic component assembly can include an electrically-conductive magnetically-permeable shield coupled to or defined by the electrically-conductive structure, the electrically-conductive magnetically-permeable shield located between the first and second component attachment regions, including a portion extending in a direction out of a plane defined by the first and second component attachment regions, to suppress magnetic coupling between the first and second components.
    Type: Application
    Filed: June 29, 2015
    Publication date: December 29, 2016
    Inventors: Aldrick S. Limjoco, Michael Cusack, Donal G. O'Sullivan, Patrick John Meehan, Thomas Conway