Abstract: A rigging comprises a mast controllably about a longitudinal axis; a flexible sail comprising a starboard and port flexible sail portions; a plurality of elongated battens which extend a luff and a leach of sail portions; each batten is pivotally connected to a respective outermost part of the respective side of the mast. Rotation of the mast causes the battens connected to one of the sail portions to be compressed along their length and causes the battens connected of the other sail portions to be tensioned along their length so as to change the shape of an aerofoil formed by the sail.

Abstract: A rigging for a wing propelled craft comprises a mast having a starboard side and a port side, wherein the mast is controllably rotatable in either direction about a longitudinal axis; a flexible sail comprising a star-board flexible sail portion and a substantially identical port flexible sail portion, each flexible sail portion having a luff and a leach, wherein the luff of each sail portion is connected to a respective side of the mast; and a plurality of elongated battens, each of which extends substantially between the luff and the leach of one of the respective sail portions, each of which is in contact with the respective flexible sail portion.

Abstract: An integrated circuit package includes a semiconductor die attached to a package support. The die has a plurality of peripheral bond pads along a periphery of the die and a first bond pad on an interior portion of the die wherein the first bond pad is a power supply bond pad. A conductive distributor is over the die and within a perimeter of the die and has a first opening. The plurality of bond pads are located between the perimeter of the die and a perimeter of the conductive distributor. The first bond pad is in the first opening. A first bond wire is connected between the first bond pad and the conductive distributor. A second bond wire is connected between a first peripheral bond pad of the plurality of peripheral bond pads and the conductive distributor.

Abstract: The present invention provides a method for diagnosing an autism spectrum disorder (ASD), or predisposition to develop an ASD, in a subject, which comprises the step of investigating a set of single nucleotide polymorphisms (SNPs) in a sample from the subject, wherein the number of SNPs in the set is such that the method can diagnose ASD with at least 70% accuracy. The invention also provides a kit for diagnosing an ASD, or predisposition to develop an ASD, in a subject, which comprises a plurality of primer pairs or probes capable of investigating such a set of SNPs in a sample from a subject, and a method for making such a kit.

Abstract: An integrated circuit package includes a semiconductor die attached to a package support. The die has a plurality of peripheral bond pads along a periphery of the die and a first bond pad on an interior portion of the die wherein the first bond pad is a power supply bond pad. A conductive distributor is over the die and within a perimeter of the die and has a first opening. The plurality of bond pads are located between the perimeter of the die and a perimeter of the conductive distributor. The first bond pad is in the first opening. A first bond wire is connected between the first bond pad and the conductive distributor. A second bond wire is connected between a first peripheral bond pad of the plurality of peripheral bond pads and the conductive distributor.

Abstract: There is described compounds for use in therapy, said compounds being defined by Formula (1): There is also described an anti-proliferative composition comprising one or more compounds according to Formula (1), and a method of treatment of neoplasia comprising the administration of such a compound or composition.

Abstract: The invention provides combination therapies and methods for the treatment of cancers associates with p53 mutations. The method comprises the separate, sequential or simultaneous administration of a therapeutically effective amount of a) a specific binding member, for example CH-11, which binds to a cell death receptor, for example Fas, or a nucleic acid encoding said binding member and b) a chemotherapeutic agent, wherein the chemotherapeutic agent is a topoisomerase inhibitor, for example CPT-1 or a thymidylate synthase inhibitor, for example TDX. Synergistic cytotoxic effects have been demonstrated using such combinations.

Abstract: Described is a method to predict response of tumour cells to in vivo treatment with a platinum-based chemotherapeutic agent, the method based on the determination of the expression of one or more of the genes encoding BCRP protein, wherein enhanced expression of said gene correlates with enhanced resistance to the chemotherapeutic agent. Also described are methods of sensitising cancer cells, particularly colorectal cancer cells to treatment.

Abstract: The invention relates to an oncofetal glycoprotein, referred to as MQ-1, nucleic acid sequences coding for the protein, and antibodies which bind specifically to the protein. Also described is a hybridoma capable of producing monoclonal antibodies which bind specifically to the protein of the invention. Methods, and kits, for diagnosing and treating cancer using the antibodies of the invention are also described. Anti-sense polynucleotides are also described, as are methods for inducing apoptosis in cells which express MQ-1.

Abstract: Arrays containing a transcriptome of a diseased tissue and methods of using the arrays for diagnosis, prognosis, screening, and identification of disease are provided herein. The transcriptome arrays from diseased tissue are useful for diagnosis of a disease by analysis of the genetic profile of a tissue sample specific to a disease state. The genetic profiles are then correlated with data on the effectiveness of specific therapeutic agents. Correlating expression profiles to the effectiveness of therapeutic agents provides a way to screen and select further patients predicted to respond to those therapeutic agents, thereby minimizing needless exposure to ineffective therapy.

Abstract: The present invention provides a method of killing cancer cells and method of treatment of cancer comprising administration of a therapeutically effective amount of a) a specific binding member which binds to a cell death receptor or a nucleic acid encoding said binding member and (b) a chemotherapeutic agent. The binding member pereferably binds to a Fas receptor. Also described are medicaments for use in treating cancer.

Abstract: A process and apparatus for chilling and aging the front portions of poultry carcasses. The process and apparatus preferably comprise and provide for (a) separating eviscerated poultry carcasses into front portions and back portions, (b) washing the front portions, (c) conducting a fecal inspection of at least some of the front portions, (d) pre-chilling the front portions in water, (e) delivering the front portions through a reconditioning washer when the fecal inspection indicates that a failure has occurred, and (f) conducting a secondary inspection at the reconditioning wash.

Abstract: The knapsack has a bottom wall resting against a user's back when supported by shoulder straps. The bottom wall is larger than a bicycle luggage carrier or rack. The knapsack has a frame structure for reinforcing the bottom wall and the side wall of the knapsack so that when the knapsack is placed with the bottom wall horizontally on top of the carrier, loose articles in the knapsack do not cause the bottom wall of the knapsack to sag over the sides of the carrier. The shoulder straps are attached to the bottom wall or sandwiched between the bottom wall and the carrier to prevent the shoulder straps from dangling down and possibly interfering with movement of the bicycle wheels. The knapsack has fastening straps for securing the knapsack to the luggage carrier. In one embodiment, the frame structure is a removable insert for a conventional knapsack.

Abstract: A semiconductor device (100) including a die (110) electrically connected to a substrate (120), wherein the substrate has a novel interconnect routing structure. The routing structure has a plurality of interconnects (122) including a plurality of intermediate vias (140), including both intermediate vias associated with supply interconnects and signal interconnects, that are clustered together to reduce undesirable mutual loop inductance (L.sub.m) and reduce switching noise (.DELTA.I). A plurality of first printed wires (128a) and a plurality of second printed wires (128b) may incorporated in the substrate for routing of the plurality intermediate vias in cluster form. The substrate may have a plurality of clusters of the intermediate vias.