Patents by Inventor Patrick Jordan Redmond

Patrick Jordan Redmond has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microbeam assembly and associated method for integrated circuit interconnection to substrates
    Patent number: 6405429
    Abstract: A microbeam interconnection method is provided to connect integrated circuit bond pads to substrate contacts. Conductive leads (microbeams) are releasably formed, by a process such as electroplating or vacuum deposition, over a release layer deposited on a ceramic, glass or similar carrier. The microbeam material adheres only very weakly to the release layer. After the inner ends of the microbeams have been bonded to IC bond pads, such as by flip chip bump bonding, and the integrated circuit has been fully tested, the IC is lifted away from the carrier, causing the microbeams to peel away from the release layer. After straightening the microbeams against a flat surface, the outer ends of the microbeams may then be bonded to contacts on an MCM or other substrate. The method permits full electrical testing at speed and high speed bonding. The method significantly reduces mechanical stresses in interconnect bonds and thereby improves integrated circuit reliability.
    Type: Grant
    Filed: August 26, 1999
    Date of Patent: June 18, 2002
    Assignee: Honeywell Inc.
    Inventors: John Whittier Slemmons, Jay Arthur Messner, Frank John Woolston, Patrick Jordan Redmond, Pierino Italo Zappella, William Richard Fewer
  • Microbeam assembly for integrated circuit interconnection to substrates
    Publication number: 20020036100
    Abstract: A microbeam interconnection method is provided to connect integrated circuit bond pads to substrate contacts. Conductive leads (microbeams) are releasably formed, by a process such as electroplating or vacuum deposition, over a release layer deposited on a ceramic, glass or similar carrier. The microbeam material adheres only very weakly to the release layer. After the inner ends of the microbeams have been bonded to IC bond pads, such as by flip chip bump bonding, and the integrated circuit has been fully tested, the IC is lifted away from the carrier, causing the microbeams to peel away from the release layer. After straightening the microbeams against a flat surface, the outer ends of the microbeams may then be bonded to contacts on an MCM or other substrate. The method permits full electrical testing at speed and high speed bonding. The method significantly reduces mechanical stresses in interconnect bonds and thereby improves integrated circuit reliability.
    Type: Application
    Filed: December 5, 2001
    Publication date: March 28, 2002
    Applicant: Honeywell, Inc.
    Inventors: John Whittier Slemmons, Jay Arthur Messner, Frank John Woolston, Patrick Jordan Redmond, Pierino Italo Zappella, William Richard Fewer