Abstract: A power, ground and communication architecture (100) utilizes hubs (105, 110, 115). Each hub (105, 110, 115) contains computing, communication and power management elements (135, 140). Hubs (105, 110, 115) may be connected to multiple other hubs (105, 110, 115) to distribute communication and power in a freeform web-type arrangement, specific tree, bus or star arrangements are not required. Standardized wiring harness segments (120) are used to join the hubs (105, 110, 115) and control elements. Each of the strands in the web may be an independent point-to-point bus and isolated power line.

Abstract: A microbeam interconnection method is provided to connect integrated circuit bond pads to substrate contacts. Conductive leads (microbeams) are releasably formed, by a process such as electroplating or vacuum deposition, over a release layer deposited on a ceramic, glass or similar carrier. The microbeam material adheres only very weakly to the release layer. After the inner ends of the microbeams have been bonded to IC bond pads, such as by flip chip bump bonding, and the integrated circuit has been fully tested, the IC is lifted away from the carrier, causing the microbeams to peel away from the release layer. After straightening the microbeams against a flat surface, the outer ends of the microbeams may then be bonded to contacts on an MCM or other substrate. The method permits full electrical testing at speed and high speed bonding. The method significantly reduces mechanical stresses in interconnect bonds and thereby improves integrated circuit reliability.

Abstract: A microbeam interconnection method is provided to connect integrated circuit bond pads to substrate contacts. Conductive leads (microbeams) are releasably formed, by a process such as electroplating or vacuum deposition, over a release layer deposited on a ceramic, glass or similar carrier. The microbeam material adheres only very weakly to the release layer. After the inner ends of the microbeams have been bonded to IC bond pads, such as by flip chip bump bonding, and the integrated circuit has been fully tested, the IC is lifted away from the carrier, causing the microbeams to peel away from the release layer. After straightening the microbeams against a flat surface, the outer ends of the microbeams may then be bonded to contacts on an MCM or other substrate. The method permits full electrical testing at speed and high speed bonding. The method significantly reduces mechanical stresses in interconnect bonds and thereby improves integrated circuit reliability.

Abstract: A process and apparatus for selectively electroplating the tip portion of an airfoil. The airfoil includes a root portion and a blade portion having a tip. At least part of the blade including the tip is coated with an insulating material. Insulating material is removed from the tip and the airfoil is mounted in a fixture so that the tip is exposed. The fixture is immersed in a sealing bath, and the fixture and at least a portion of the airfoil is encased in sealing material while leaving the tip exposed. The fixture is then immersed in an electroplating bath, the exposed tip is electroplated, and the fixture is removed from the bath. The fixture includes an elongated base member and a grip element supported on the base member. The grip element is made of a flexible material and has a plurality of slots configured for receiving the root portion of the airfoils. An electrical contact is provided in each slot so as to contact the root portion of the airfoil. A plurality of fixture may be mounted on a carousel.

Abstract: An infant care apparatus that has a infant bed tilt mechanism that can be accessed by the user in close proximity to the infant mattress and at the mattress level. When the infant care apparatus is an infant incubator, the tilt mechanism is operable internal of the infant compartment. The user can thus be carrying out some procedure on the infant within that infant compartment of the incubator or at the level of the infant bed of an infant warmer and be able to alter the tilt angle of the infant bed without breaking the semi sterile conditions surrounding the infant and its close proximity by manipulation of a actuating mechanism that is situated at the level of the infant bed and in close proximity to the infant. The tilt mechanism itself has a lead screw rotatable mounted to the infant bed and which passes through a threaded nut that is resiliently affixed to the base of the incubator or infant warmer.

Abstract: A process and apparatus for selectively electroplating the tip portion of an airfoil. The airfoil includes a root portion and a blade portion having a tip. At least part of the blade including the tip is coated with an insulating material. Insulating material is removed from the tip and the airfoil is mounted in a fixture so that the tip is exposed. The fixture is immersed in a sealing bath, and the fixture and at least a portion of the airfoil is encased in sealing material while leaving the tip exposed. The fixture is then immersed in an electroplating bath, the exposed tip is electroplated, and the fixture is removed from the bath.