Abstract: A thermal regulating device is provided that includes an inlet tube and an outlet tube disposed inside the inlet tube. An axial cartridge includes fins disposed along the axial cartridge, where the fins span a channel defined between an inner surface of the inlet tube and an outer surface of the outlet tube. The fins are segmented and offset in a staggered configuration from each other.

Abstract: A thermal regulating device is provided that includes a head portion including an inlet port and an outlet port, and a tubular, rod-shaped portion in fluid communication with the head portion at a first end and being enclosed at a second end opposite that of the first end. An axial cartridge is disposed in the tubular, rod-shaped portion, where the axial cartridge provides thermal transfer to an outer surface of the tubular, rod-shaped portion. The tubular, rod-shaped portion detachably mates with a device to provide thermal transfer to the device.

Abstract: A thermal regulating device is provided that includes a head portion including an inlet port and an outlet port, and a tubular, rod-shaped portion in fluid communication with the head portion at a first end and being enclosed at a second end opposite that of the first end. An axial cartridge is disposed in the tubular, rod-shaped portion, where the axial cartridge provides thermal transfer to an outer surface of the tubular, rod-shaped portion. The tubular, rod-shaped portion detachably mates with a device to provide thermal transfer to the device.

Abstract: Slots or apertures are formed in the connector shroud of a T/R module in a plane perpendicular to the axis of the connector so as to allow plating solution to flow freely through the entire inner portion of the connector, particularly the rear portion, during fabrication of the T/R module. The slots are formed prior to the shroud being brazed on to the module substrate. By allowing plating solution to flow through the connector, the interior of the connector can be more thoroughly plated, thereby improving the yield of the assembly while reducing cost.

Abstract: A miniature, self-locking, spring action, microwave T/R module retainer device includes a retainer body that holds a double arched spring and transfers the spring load to a coldplate. The double arched spring configuration is designed to contact an extended heat sink plate located on one side of the microwave T/R module. When in position, the deflection of the double arched spring of the retainer device imparts a force onto the extended heat sink, pressing the T/R module against the coldplate when the module retainer device is installed. If the position of the T/R module changes due to thermal or mechanical loads, the potential energy stored in the arched spring allows the spring to automatically re-adjust accordingly.

Abstract: Two discrete transmit/receive (T/R) channels are implemented in a single common T/R module package having the capability of providing combined functions, control and power conditioning while utilizing a single multi-cavity, multi-layer substrate comprised of high or low temperature cofired ceramic layers. The ceramic layers have outer surfaces including respective metallization patterns of ground planes and stripline conductors as well as feedthroughs or vertical vias formed therein for providing three dimensional routing of both shielded RF and DC power and logic control signals so as to configure, among other things, a pair of RF manifold signal couplers which are embedded in the substrate and which transition to a multi-pin blind mate press-on RF connector assembly at the front end of the package.

Abstract: Two discrete transmit/receive (T/R) channels are implemented in a single common T/R module package having the capability of providing combined functions, control and power conditioning while utilizing a single multi-cavity, multi-layer substrate comprised of high temperature cofired ceramic (HTCC) layers. The ceramic layers have outer surfaces including respective metallization patterns of ground planes and stripline conductors as well as feedthroughs or vertical vias formed therein for providing three dimensional routing of both shielded RF and DC power and logic control signals so as to configure, among other things, a pair of RF manifold signal couplers which are embedded in the substrate and which transition to a multi-pin blind mate press-on RF connector assembly at the front end of the package.

Abstract: A transmit/receive (T/R) module adapted for use in a radar system. The module has a unified structure including a layered substrate on and in which two T/R channel circuits are integrated. The channel circuits make use of power distribution, channel controller, and RF signal routing circuitry, partly on a channel shared basis. In the RF routing circuitry, respective coupler elements are employed to combine RF receive signals for output to an RF receive manifold and to split an RF transmit signal from a transmit manifold into separate RF transmit signals for input to the T/R channel circuits.

Abstract: Two discrete transmit/receive (T/R) channels are implemented in a single common T/R module package having the capability of providing combined functions, control and power conditioning while utilizing a single multi-cavity, multi-layer substrate comprised of high temperature cofired ceramic (HTCC) layers. The ceramic layers have outer surfaces including respective metallization patterns of ground planes and stripline conductors as well as feedthroughs or vertical vias formed therein for providing three dimensional routing of both shielded RF and DC power and logic control signals so as to configure, among other things, a pair of RF manifold signal couplers which are embedded in the substrate and which transition to a multi-pin blind mate press-on RF connector assembly at the front end of the package.

Abstract: A transmit/receive (T/R) module adapted for use in a radar system. The module has a unified structure including a layered substrate on and in which two T/R channel circuits are integrated. The channel circuits make use of power distribution, channel controller, and RF signal routing circuitry, partly on a channel shared basis. In the RF routing circuitry, respective coupler elements are employed to combine RF receive signals for output to an RF receive manifold and to split an RF transmit signal from a transmit manifold into separate RF transmit signals for input to the T/R channel circuits.

Abstract: An antenna assembly for an active electronically scanned array includes, among other things: an array of antenna elements; an RF signal feed and circulator assembly coupled to said antenna elements and forming thereby an array of radiating structures; a generally planar RF manifold assembly having regularly spaced openings therein located behind and normal to the radiating structures; an array of T/R modules connected to the array of radiating structures and having respective RF connector assemblies forming a portion of an RF interface at one end portion of each of the modules which project upwardly through said spaced openings in the RF manifold and wherein the respective connector assemblies thereof connect to at least one immediately adjacent circulator as well as to transmit and receive manifold portions of the RF manifold; each of the T/R modules further have a heat sink plate on the back side thereof which is positioned against one of a number of elongated liquid coolant circulating coldplates connected