Abstract: A method for producing a lens mold suitable for manufacturing a field of micro-lenses is disclosed. The method includes the step of molding the lens mold from a sheaf of closely-packed balls held by a hexagonal mounting.

Abstract: A radiation source has a field of semiconductor chips, which are disposed below a field of micro-lenses (8) disposed in a hexagonal lattice structure. The radiation source is distinguished by high radiation output and radiation density.

Abstract: In order to apply an optical element such as a lens, for example, to an optoelectronic component, the surface (3B), averted from the transmitter or receiver (2), of the filling material (3) is designed directly with a lens profile (7). This is done by filling a defined quantity of the transparent filling material (3) into the recess (1A) of the carrier body (1) for the purpose of embedding the transmitter or receiver (2), and by subsequently impressing a lens profile (7) onto the surface (3B), averted from the transmitter or receiver, of the transparent filling material (3) by means of a punch (8), before the transparent filling material with the lens profile (7) thus impressed is completely cured.

Abstract: The invention relates to a housing for at least two radiation-emitting components, especially LEDs, comprising a system carrier (1) and a reflector arrangement (2) arranged on said system carrier (1). Said reflector arrangement comprises a number of reflectors that are respectively used to receive at least one radiation-emitting component and are fixed together by means of a holding device (4).

Abstract: The invention relates to an illumination device for backlighting an image reproduction device that contains light valves. Said device is characterised in that light spots formed respectively by at least one light emitting diode are arranged in a grid on a thermally conductive support. The respective surface area of the light spots is less than that of the surface area defined by the grid.

Abstract: An optoelectronic component (1) having a semiconductor arrangement (4) which emits and/or receives electromagnetic radiation and which is arranged on a carrier (22) which is thermally conductively connected to a heat sink (12). External electrical connections (9) are connected to the semiconductor arrangement (4), where the external electrical connections (9) are arranged in electrically insulated fashion on the heat sink (12) at a distance from the carrier (22). This results in an optimized component in terms of the dissipation of heat loss and the radiation of light and also in terms of making electrical contact and the packing density in modules.

Abstract: A light source module having a plurality of LEDs connected to a metal carrier (4) by means of an insulating layer (3). In order to afford protection against mechanical effects and in order to form a reflector, the LEDs are surrounded by a frame (10), which is segmented into a plurality of parts by expansion joints (13), in order that stresses occurring as a result of temperature fluctuations are absorbed.

Abstract: An optoelectronic component having a basic housing or frame (12) and at least one semiconductor chip (20), specifically a radiation-emitting or -receiving semiconductor chip, in a cavity (18) of the basic housing. In order to increase the efficiency of the optoelectronic component (10), reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound (28) filled at least partly into the cavity (18) is provided, the material and the quantity of the filling compound (28) being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas (30) of the filling compound serve as reflector.

Abstract: An optoelectronic component having a basic housing or frame (12) and at least one semiconductor chip (20), specifically a radiation-emitting or -receiving semiconductor chip, in a cavity (18) of the basic housing. In order to increase the efficiency of the optoelectronic component (10), reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound (28) filled at least partly into the cavity (18) is provided, the material and the quantity of the filling compound (28) being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas (30) of the filling compound serve as reflector.

Abstract: An optoelectronic component having a basic housing or frame (12) and at least one semiconductor chip (20), specifically a radiation-emitting or -receiving semiconductor chip, in a cavity (18) of the basic housing. In order to increase the efficiency of the optoelectronic component (10), reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound (28) filled at least partly into the cavity (18) is provided, the material and the quantity of the filling compound (28) being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas (30) of the filling compound serve as reflector.

Abstract: In order to apply an optical element such as a lens, for example, to an optoelectronic component, the surface (3B), averted from the transmitter or receiver (2), of the filling material (3) is designed directly with a lens profile (7). This is done by filling a defined quantity of the transparent filling material (3) into the recess (1A) of the carrier body (1) for the purpose of embedding the transmitter or receiver (2), and by subsequently impressing a lens profile (7) onto the surface (3B), averted from the transmitter or receiver, of the transparent filling material (3) by means of a punch (8), before the transparent filling material with the lens profile (7) thus impressed is completely cured.

Abstract: An optoelectronic component having a basic housing or frame (12) and at least one semiconductor chip (20), specifically a radiation-emitting or -receiving semiconductor chip, in a cavity (18) of the basic housing. In order to increase the efficiency of the optoelectronic component (10), reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound (28) filled at least partly into the cavity (18) is provided, the material and the quantity of the filling compound (28) being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas (30) of the filling compound serve as reflector.

Abstract: A radiation source has a field of semiconductor chips, which are disposed below a field of micro-lenses (8) disposed in a hexagonal lattice structure. The radiation source is distinguished by high radiation output and radiation density.