Abstract: A method to integrate thermal drop on demand ink jet devices and related pulse driver circuitry for chips used in thermal ink jet printers. This integrated printhead chip is made by first fabricating on the substrate the driver pulse circuitry through the last level of metallization. Once complete, a low temperature (<400 C) CVD oxide is deposited and planarized. It is of sufficient thickness (3 to 4 microns) to insure a good thermal barrier between the pulse circuitry and the thermal inkjet devices. After planarization, the resistor material is deposited and patterned. Openings are then patterned to the inputs and outputs of the pulse driver circuitry. Aluminum copper metallurgy is deposited and patterned to connect the resistor to the pulse driver output and define the heater resistor areas. Inorganic and organic barrier layers are applied and patterned to protect the resistor material and interconnecting metallurgy from the corrosive effects of the ink.

Abstract: This application discloses a novel method to integrate thermal drop on demand ink jet devices and related pulse driver circuitry for chips used in thermal ink jet printers. This integrated printhead chip is made by first fabricating on the substrate the driver pulse circuitry through the last level of metallization. Once complete, a low temperature (<400 C.) CVD oxide is deposited and planarized. It is of sufficient thickness (3 to 4 microns) to insure a good thermal barrier between the pulse circuitry and the thermal inkjet devices. After planarization, the resistor material is deposited and patterned. Openings are then patterned to the inputs and outputs of the pulse driver circuitry. Aluminum copper metallurgy is deposited and patterned to connect the resistor to the pulse driver output and define the heater resistor areas. Inorganic and organic barrier layers are applied and patterned to protect the resistor material and interconnecting metallurgy from the corrosive effects of the ink.