Abstract: A device includes comprising first and second printed circuit boards. Walls couple the first and second printed circuit boards to each other and define a first cavity between the first and second printed circuit boards. Electric conductors associated with the walls electrically connect the first and second printed circuit boards. An integrated circuit chip is mounted to a first surface of the first integrated circuit board in the first cavity. The integrated circuit chip is electrically connected to conductive tracks of the first surface of the first printed circuit board. Surface-mounted components are mounted on top of and in contact with conductive tracks of a first surface of the second printed circuit board. The first surfaces of the first and second printed circuit boards are arranged facing towards each other. The first and second printed circuit boards may form rigid components of a flex-rigid type printed circuit board.

Abstract: An electronic device that includes: a substrate including a first contact pad; a cap including a front surface, the cap being attached to a surface of the substrate, the front surface including a first recess and a second recess within the first recess, the cap including a first leadframe embedded within the cap; a first device mounted over the cap and within the second recess; and an optical lens mounted over the cap and the first device, where a first end of the first leadframe is extended out of the cap and electrically connected to the first contact pad, and where a second end of the first leadframe is extended out of the cap at the front surface and electrically connected to the first device.

Abstract: An integrated circuit optical package includes a support substrate having a mounting face and an electrical interconnection network between the mounting face and contact pads located on a lower face of the support substrate. A cap includes a lateral wall fastened on the mounting face and an upper wall including a first opening. A first optical element is fastened on the upper wall of the cap to seal the first opening. An electromagnetic shielding element is embedded in the cap and configured to be coupled to a reference supply point via the interconnection network and at least one contact pad. A first electronic chip is mounted on the mounting face and in optical cooperation with the first optical element.

Abstract: An integrated circuit package includes a support substrate having a mounting face and a lateral wall having an inner face and an outer face. The inner face delimits with the mounting face a cavity. The outer face includes a step extending outwardly of the package. An electronic chip disposed in the cavity and electrically connected to electrically-conductive contact pads. A sealing structure is bonded by a glue to an upper face of the lateral wall to seal the cavity. The glue does not spill out over the outer face of the lateral wall. Electrically-conductive connection elements are located over a lower face of the support substrate and electrically cooperate with the contact pads through an interconnection network located in the support substrate.

Abstract: An integrated circuit chip includes a front face having an electrical connection pad. An overmolded encapsulation block encapsulates the integrated circuit chip and includes a front layer at least partially covering a front face of the integrated circuit chip. A through-hole the encapsulation block is located above the electrical connection pad of the integrated circuit chip. A wall of the through-hole is covered with an inner metal layer that is joined to the front pad of the integrated circuit chip. A front metal layer covers a local zone of the front face of the front layer, with the front metal layer being joined to the inner metal layer to form an electrical connection. The inner metal layer and the front metal layer are attached or anchored to activated additive particles that are included in the material of the encapsulation block.

Abstract: A device includes comprising first and second printed circuit boards. Walls couple the first and second printed circuit boards to each other and define a first cavity between the first and second printed circuit boards. Electric conductors associated with the walls electrically connect the the first and second printed circuit boards. An integrated circuit chip is mounted to a first surface of the first integrated circuit board in the first cavity. The integrated circuit chip is electrically connected to conductive tracks of the first surface of the first printed circuit board. Surface-mounted components are mounted on top of and in contact with conductive tracks of a first surface of the second printed circuit board. The first surfaces of the first and second printed circuit boards are arranged facing towards each other. The first and second printed circuit boards may form rigid components of a flex-rigid type printed circuit board.

Abstract: An integrated circuit chip includes a front face having an electrical connection pad. An overmolded encapsulation block encapsulates the integrated circuit chip and includes a front layer at least partially covering a front face of the integrated circuit chip. A through-hole the encapsulation block is located above the electrical connection pad of the integrated circuit chip. A wall of the through-hole is covered with an inner metal layer that is joined to the front pad of the integrated circuit chip. A front metal layer covers a local zone of the front face of the front layer, with the front metal layer being joined to the inner metal layer to form an electrical connection. The inner metal layer and the front metal layer are attached or anchored to activated additive particles that are included in the material of the encapsulation block.

Abstract: An integrated circuit chip includes a front face having an electrical connection pad. An overmolded encapsulation block encapsulates the integrated circuit chip and includes a front layer at least partially covering a front face of the integrated circuit chip. A through-hole the encapsulation block is located above the electrical connection pad of the integrated circuit chip. A wall of the through-hole is covered with an inner metal layer that is joined to the front pad of the integrated circuit chip. A front metal layer covers a local zone of the front face of the front layer, with the front metal layer being joined to the inner metal layer to form an electrical connection. The inner metal layer and the front metal layer are attached or anchored to activated additive particles that are included in the material of the encapsulation block.

Abstract: An integrated circuit chip includes a front face having an electrical connection pad. An overmolded encapsulation block encapsulates the integrated circuit chip and includes a front layer at least partially covering a front face of the integrated circuit chip. A through-hole the encapsulation block is located above the electrical connection pad of the integrated circuit chip. A wall of the through-hole is covered with an inner metal layer that is joined to the front pad of the integrated circuit chip. A front metal layer covers a local zone of the front face of the front layer, with the front metal layer being joined to the inner metal layer to form an electrical connection. The inner metal layer and the front metal layer are attached or anchored to activated additive particles that are included in the material of the encapsulation block.

Abstract: Digital subtraction angiography is used to improve the contrast of images of patient vasculature. A non-contrast image is recorded with no contrast medium injected into the patient, and then a succession of contrast images is captured after the injection of a contrast medium. The non-contrast image is successively registered to the contrast images, and then subtracted. This removes background structures, but leaves the vasculature untouched, making blood vessels easier to see. Artifacts can remain when different motion layers are present in the X-ray image (for example, the spine and the lungs). This application discusses a technique to prevent artifacts occurring when different motion layers are present in an X-ray frame or sequence.

Abstract: Digital subtraction angiography is used to improve the contrast of images of patient vasculature. A non-contrast image is recorded with no contrast medium injected into the patient, and then a succession of contrast images is captured after the injection of a contrast medium. The non-contrast image is successively registered to the contrast images, and then subtracted. This removes background structures, but leaves the vasculature untouched, making blood vessels easier to see. Artefacts can remain when different motion layers are present in the X-ray image (for example, the spine and the lungs). This application discusses a technique to prevent artefacts occurring when different motion layers are present in an X-ray frame or sequence.

Abstract: An integrated-circuit chip and external electrical connection elements are arranged on a first side of a substrate to form an assembly that is placed within a mold. The mold includes first and second opposed planar faces with a molding film made of a deformable material on the first planar face. The molding film is pressed against end faces of the external electrical connection elements. Encapsulating material then fills the mold cavity producing a semiconductor device that, when removed from the mold, includes electrical connection elements that are peripherally coated by the encapsulating material and have exposed end faces. An additional semiconductor device may be mounted over and in electrical connection with the electrical connection elements through the exposed end faces.

Abstract: This invention relates to monoclonal and polyclonal antibodies capable of specifically recognizing IL-13 receptor ? and uses thereof.

Abstract: This invention relates to monoclonal and polyclonal antibodies capable of specifically recognizing IL-13 receptor ? and uses thereof.

Abstract: This invention relates to a purified polypeptide comprising an amino acid sequence chosen from the sequence SEQ ID NO:4 or biologically active amino acid sequences derived from SEQ ID NO:4.

Abstract: Semiconductor device (1) and process for fabricating it, the device (1) including an electrical connection support plate (2), an integrated circuit chip placed at a certain location on the support plate (2) and placed at a certain distance from this support plate (2), a plurality of electrical connection balls connecting electrical connection regions (4) of the support plate (2) and corresponding electrical connection pads on the integrated circuit chip, and a fill material at least partly filling the space separating the chip from the plate, and in which the surface of the support plate (2), which has the electrical connection regions (4), is provided with an interlayer (6) made of an insulating material in which apertures (7) are provided above the electrical connection regions (4) and above complementary flow channels (9, 10).

Abstract: A device for setting a total knee prosthesis includes: a tensioning component (1) having: a tibial plate (2), a slide (5) mobile along a rail (3) and elements (6, 11) for being fixed to an ancillary component including a centro-medullar rod and a tibial plate and capable of receiving variable-width wedging elements; and a motoring elements (8, 10) for tensioning the knee when the plate is applied on a tibial section and the ancillary component (20) secured to the slide, a perforating guide capable of being mounted on the rail (3) and having drilling holes; the guide capable of including or of being associated with a member for palpation of the anterior part of the femur; and locating elements (EF) for determining the interarticular space available in flexure, thereby enabling the distal femoral section plane or the posterior section plane to be accurately determined.

Abstract: This invention relates to a purified polypeptide comprising an amino acid sequence chosen from the sequence SEQ ID NO:4 or biologically active amino acid sequences derived from SEQ ID NO:4.

Abstract: This invention relates to monoclonal and polyclonal antibodies capable of specifically recognizing IL-13 receptor ? and/or IL13 receptor ? and uses thereof.

Abstract: This invention relates to a purified polypeptide, comprising an amino acid sequence chosen from: a) the sequence SEQ ID No. 2, b) any biologically active sequence derived from SEQ ID No. 2.