Abstract: A method for jamming airborne SAR radar implemented by a jamming device includes at least two cooperating units surrounding an area on the ground to be protected, at least two units providing a radar-detection function and at least one unit providing a radar-jamming function, each unit being interlinked by a two-way data link and being synchronized by a common clock, the method comprises a step of identifying the signals received and whether the received signals correspond to SAR signals; a step of characterizing the received SAR signal over a short duration; a step of computing a filter adapted to the signal; a step of carrying out pulse compression of the signal; a step of iteratively periodically characterizing the signal over a long duration; a step of computing the jamming signals to be transmitted; a step of transmitting the jamming signals.

Abstract: A method for jamming airborne SAR radar implemented by a jamming device includes at least two cooperating units surrounding an area on the ground to be protected, at least two units providing a radar-detection function and at least one unit providing a radar-jamming function, each unit being interlinked by a two-way data link and being synchronized by a common clock, the method comprises a step of identifying the signals received and whether the received signals correspond to SAR signals; a step of characterizing the received SAR signal over a short duration; a step of computing a filter adapted to the signal; a step of carrying out pulse compression of the signal; a step of iteratively periodically characterizing the signal over a long duration; a step of computing the jamming signals to be transmitted; a step of transmitting the jamming signals.

Abstract: A self-encapsulated power conductor component with improved heat transfer has a chip bearing at least one power transistor having at least one interdigitated electrode, provided with an air bridge, and a sink provided with at least one metal islet in relief. The air bridge is reinforced and the chip is brazed in reverse to the islet of the sink by its air bridge. Other islets brazed to the metallizations on the rim of the chip reinforce the mechanical fixing. The access to the electrodes is obtained by via holes and the second face of the substrate may receive non-integrable components. The device can be applied to power transistors and integrated circuits, notably on GaAs.