Abstract: The present invention relates to a rod handling apparatus for a drill rig including a drill rig mast and a hoisting winch. The rod handling apparatus including: a base assembly; a frame assembly coupled to the base assembly, the frame assembly including a pair of rails along which a conveyor assembly is adapted to travel along; and, the conveyor assembly adapted to be coupled to the hoisting winch for conveying a drill rod up and/or down the drill rig mast such that the drill rod is attachable to and/or detachable from a drill string.

Abstract: A solution for providing electroless deposition of a metal layer on a substrate is provided. A solvent is provided. A metal precursor is provided to the solvent. A first borane containing reducing agent is provided to the solvent. A second borane containing reducing agent is provided to the solvent, wherein the first borane containing reducing agent has a deposition rate of at least five times a deposition rate of the second borane containing reducing agent, and wherein the solution is free of nonborane reducing agents.

Abstract: A key fob cover system for inhibiting a key fob from being inadvertently manipulated includes a key fob. A plurality of buttons is provided and each of the buttons is coupled to the key fob. Thus, each of the buttons may be manipulated. A cover is slidably positioned on the key fob. The cover covers the buttons when the cover is positioned on the key fob such that the cover inhibits the buttons from being inadvertently manipulated.

Abstract: A solution for providing electroless deposition of a metal layer on a substrate is provided. A solvent is provided. A metal precursor is provided to the solvent. A first borane containing reducing agent is provided to the solvent. A second borane containing reducing agent is provided to the solvent, wherein the first borane containing reducing agent has a deposition rate of at least five times a deposition rate of the second borane containing reducing agent, and wherein the solution is free of nonborane reducing agents.

Abstract: A solution for providing electroless deposition of a metal layer on a substrate is provided. A solvent is provided. A metal precursor is provided to the solvent. A first borane containing reducing agent is provided to the solvent. A second borane containing reducing agent is provided to the solvent, wherein the first borane containing reducing agent has a deposition rate of at least five times a deposition rate of the second borane containing reducing agent, and wherein the solution is free of nonborane reducing agents.

Abstract: A solution for providing electroless deposition of a metal layer on a substrate is provided. A solvent is provided. A metal precursor is provided to the solvent. A first borane containing reducing agent is provided to the solvent. A second borane containing reducing agent is provided to the solvent, wherein the first borane containing reducing agent has a deposition rate of at least five times a deposition rate of the second borane containing reducing agent, and wherein the solution is free of nonborane reducing agents.

Abstract: A solar cell includes a first electrode located over a substrate, at least one first conductivity type semiconductor layer located over the first electrode, at least one second conductivity type semiconductor layer located over the first conductivity semiconductor layer, and a transparent conductive oxide contact layer located over the second conductivity semiconductor layer. The first surface of the transparent conductive oxide contact layer may be located closer to the second conductivity type semiconductor layer than the second surface of the transparent conductive oxide contact layer, and the transparent conductive oxide contact layer may have an oxygen concentration that decreases continuously or in at least two discrete steps as a function of thickness for at least a first portion of the contact layer thickness in a direction from the first surface to the second surface.

Abstract: The concept of electromagnetic bandgaps (EBG) is used to develop a high quality filter that can be integrated monolithically with other components due to a reduced height, planar design. Coupling adjacent defect elements in a periodic lattice creates a filter characterized by ease of fabrication, high-Q performance, high port isolation and integrability to planar or 3-D circuit architectures. The filter proof of concept has been demonstrated in a metallo-dielectric lattice. The measured and simulated results of 2-, 3- and 6-pole filters are presented at 10.7 GHz, along with the equivalent circuits.

Abstract: Methods and pharmaceutical compositions for the treatment of pain, preferably with lowered risk of induction of seizure in a patient.

Abstract: The concept of electromagnetic bandgaps (EBG) is used to develop a high quality filter that can be integrated monolithically with other components due to a reduced height, planar design. Coupling adjacent defect elements in a periodic lattice creates a filter characterized by ease of fabrication, high-Q performance, high port isolation and integrability to planar or 3-D circuit architectures. The filter proof of concept has been demonstrated in a metallodielectric lattice. The measured and simulated results of 2, 3 and 6 pole filters are presented at 10.7 GHz, along with the equivalent circuits.

Abstract: Methods and pharmaceutical compositions for the treatment of pain, preferably with lowered risk of induction of seizure in a patient.