Patents by Inventor Patrick Loney

Patrick Loney has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit having a heat sink coupled to separate ground planes through vias with different thermal characteristics
    Patent number: 10727162
    Abstract: An integrated circuit is provided that comprises a thermal sink layer, a first ground plane associated with a first set of circuits that have a first operational temperature requirement, and a first thermally conductive via that couples the first ground plane to the thermal sink layer. The circuit further comprises a second ground plane associated with a second set of circuits that have a second operational temperature requirement that is higher than the first operational temperature requirement, and a second thermally conductive via that couples the second ground plane to the thermal sink layer, wherein the first thermally conductive via has a greater volume of thermal conductive material than the second thermally conductive via to remove heat from the first set of circuits with less gradient than the second set of circuits.
    Type: Grant
    Filed: January 7, 2019
    Date of Patent: July 28, 2020
    Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: Patrick Loney, Robert Miles Young, Daniel Robert Queen, Aaron Ashley Hathaway, John X. Przybysz
  • MULTIPLE GROUND PLANE THERMAL SINK
    Publication number: 20190157184
    Abstract: An integrated circuit is provided that comprises a thermal sink layer, a first ground plane associated with a first set of circuits that have a first operational temperature requirement, and a first thermally conductive via that couples the first ground plane to the thermal sink layer. The circuit further comprises a second ground plane associated with a second set of circuits that have a second operational temperature requirement that is higher than the first operational temperature requirement, and a second thermally conductive via that couples the second ground plane to the thermal sink layer, wherein the first thermally conductive via has a greater volume of thermal conductive material than the second thermally conductive via to remove heat from the first set of circuits with less gradient than the second set of circuits.
    Type: Application
    Filed: January 7, 2019
    Publication date: May 23, 2019
    Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: PATRICK LONEY, ROBERT MILES YOUNG, DANIEL ROBERT QUEEN, AARON ASHLEY HATHAWAY, JOHN X. PRZYBYSZ
  • Cryogenic Integrated Circuit having a Heat Sink coupled to Separate Ground Planes through Differently Sized Thermal Vias
    Publication number: 20190080983
    Abstract: An integrated circuit is provided that comprises a thermal sink layer, a first ground plane associated with a first set of circuits that have a first operational temperature requirement, and a first thermally conductive via that couples the first ground plane to the thermal sink layer. The circuit further comprises a second ground plane associated with a second set of circuits that have a second operational temperature requirement that is higher than the first operational temperature requirement, and a second thermally conductive via that couples the second ground plane to the thermal sink layer, wherein the first thermally conductive via has a greater volume of thermal conductive material than the second thermally conductive via to remove heat from the first set of circuits with less gradient than the second set of circuits.
    Type: Application
    Filed: September 14, 2017
    Publication date: March 14, 2019
    Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: PATRICK LONEY, ROBERT MILES YOUNG, DANIEL ROBERT QUEEN, AARON ASHLEY HATHAWAY, JOHN X. PRZYBYSZ
  • Cryogenic integrated circuit having a heat sink coupled to separate ground planes through differently sized thermal vias
    Patent number: 10229864
    Abstract: An integrated circuit is provided that comprises a thermal sink layer, a first ground plane associated with a first set of circuits that have a first operational temperature requirement, and a first thermally conductive via that couples the first ground plane to the thermal sink layer. The circuit further comprises a second ground plane associated with a second set of circuits that have a second operational temperature requirement that is higher than the first operational temperature requirement, and a second thermally conductive via that couples the second ground plane to the thermal sink layer, wherein the first thermally conductive via has a greater volume of thermal conductive material than the second thermally conductive via to remove heat from the first set of circuits with less gradient than the second set of circuits.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: March 12, 2019
    Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: Patrick Loney, Robert Miles Young, Daniel Robert Queen, Aaron Ashley Hathaway, John X. Przybysz