Abstract: A sled docking system for moving a sled carriage on or off a sled rail. The sled docking system includes a docking assembly which can carry a sled carriage. The docking assembly has a moving member which allows the docking assembly to be moved to any desired location including a location adjacent to the sled rail such that the sled carriage can be moved between the sled rail and the docking assembly.

Abstract: A sled testing system comprising a first carriage and a second carriage, the first carriage and second carriage being movably mounted together, and an acceleration absorption assembly located relative to the first carriage and the second carriage such that when the second carriage is accelerated at a second carriage rate, the first carriage will be accelerated at a first carriage rate.

Abstract: Etching processes are disclosed for producing a graded or stepped edge profile in a contact pad formed between a chip passivating layer and a solder bump. The stepped edge profile reduces edge stress that tends to cause cracking in the underlying passivating layer. The pad comprises a bottom layer of chromium, a top layer of copper and an intermediate layer of phased chromium-copper. An intermetallic layer of CuSn forms if and when the solder is reflowed, in accordance with certain disclosed variations of the process. In all the variations, the solder is used as an etching mask in combination with several different etching techniques including electroetching, wet etching, anisotropic dry etching and ion beam etching.