Abstract: A method and apparatus for generating electrical energy from combustion of biomass is provided. The present invention provides both liquid-phase and gas-phase fuel to an internal combustion engine that is designed to run on both types of fuel. Scrubbing syngas generated in an updraft gasifier with a first petrochemical-based liquid fuel reduces the concentration of tars in the syngas stream and also enables absorption of tars from the syngas into the first liquid fuel. After absorption, the tars form a second liquid fuel that is suitable for direct use in the internal combustion engine. As a result, the syngas provided to the engine is substantially free of tars and the volume of liquid fuel available to the engine is increased.

Abstract: A method and apparatus for generating electrical energy from combustion of biomass is provided. The present invention provides both liquid-phase and gas-phase fuel to an internal combustion engine that is designed to run on both types of fuel. Scrubbing syngas generated in an updraft gasifier with a first petrochemical-based liquid fuel reduces the concentration of tars in the syngas stream and also enables absorption of tars from the syngas into the first liquid fuel. After absorption, the tars form a second liquid fuel that is suitable for direct use in the internal combustion engine. As a result, the syngas provided to the engine is substantially free of tars and the volume of liquid fuel available to the engine is increased.

Abstract: An on-board chip package has a hermetically sealed connector mechanically secured to a printed wiring board and electrically connected to input/output pads on the board. Chip dies are mechanically bonded to the board and then individually encapsulated with a suitable potting material. The entire assembly is coated with an encapsulating polymer, which partially overlaps the inboard side of the hermetic connector housing and which provides a relatively smooth, crevice-free outer surface. The entire assembly is then covered, in the preferred embodiment, with a metal layer, to hermetically seal the entire chip-on-board assembly.

Abstract: A process of manufacturing a flexible metallized polymer film cover which provides environmental protection of electronic assemblies such as circuit card assemblies which are susceptible to external environmental factors which can impede functional performance and reduce reliability. The use of a metallized polymer film in the form of a two layer film, with two intimately bonded layers one being electrically insulative and the other metallic, provides environmental and electrical protection of the enclosed assembly.

Abstract: A flexible metallized polymer film cover provides environmental protection of electronic assemblies such as circuit card assemblies which are susceptible to external environmental factors which can impede functional performance and reduce reliability. The fully integrated cover provides this protection and also allows for circuit repair and rework in such a manner as to make cover removal and reseal economically attractive. The use of a metallized polymer film in the form of a two layer film, with two intimately bonded layers one being electrically insulative and the other metallic, provides environmental and electrical protection of the enclosed assembly. The variables of film materials and thicknesses allow for specific cover designs to be fabricated to meet various requirements for assembly protection. The flexible film nature of the cover allows for strict conformance to underlying devices and less dimension and weight for the assembly.