Abstract: A heater includes an aluminum nitride (AlN) substrate and a heating layer. The heating layer is made from a molybdenum material and is bonded to the AlN substrate via transient liquid phase bonding. The heater can also include a routing layer and a plurality of first conductive vias connecting the heating layer to the routing layer. The routing layer and the plurality of first conductive vias can be made from the molybdenum material and at least one of the routing layer and the plurality of first conductive vias are bonded to the AlN substrate via a transient liquid phase bond. A plurality of second conductive vias connecting the routing layer to a surface of the AlN substrate can be included and the plurality of second conductive vias are made of the molybdenum material and can be bonded to the AlN substrate via a transient liquid phase bond.

Abstract: An oscillating heat pipe (OHP) device that comprise a body having a top face, a bottom face and at least one side face, a plurality of hollow OHP channels formed internally within the body, and an oscillating heat pipe (OHP) flushing duct system. The flushing duct system is formed in at least one of a body top face, a bottom face and at least one side face of an OHP device. The flushing duct system fluidly connects one or more of a plurality of OHP channels formed internally within the OHP device to an ambient environment of the device. The flushing duct system comprising at least one welding receptacle.

Abstract: A support pedestal includes a support member including a resistive layer having a plurality of zones, a routing layer, and a plurality of conductive vias. The plurality of zones are defined by a plurality of independently controllable resistive heating elements. The resistive layer and the routing layer are disposed in different planes of the support member and are connected by the plurality of conductive vias.

Abstract: A heater includes a sintered assembly and a functional element disposed on one of opposing surfaces of the sintered assembly. The heater is manufactured by a method that includes hot pressing a ceramic powder and a plurality of first slugs and forming the sintered assembly including a ceramic substrate and the plurality of first slugs embedded therein, forming the functional element on the one opposing surface of the sintered assembly such that the functional element is connected to the plurality of first slugs, and forming a monolithic substrate in which the functional element and the plurality of first slugs are embedded.

Abstract: A heater system is provided. The system includes a resistive element with a temperature coefficient of resistance (TCR) of at least about 1,000 ppm such that the resistive element functions as a heater and as a temperature sensor and the resistive element is a material having greater than about 95% nickel. The system also includes a heater control module including a two-wire controller with a power control module that is configured to periodically compare a measured resistance value of the resistive element against a reference temperature to adjust for resistance drift over time during operation such that a temperature drift of the resistive element is less than about 1% over a temperature range of about 500° C.-1,000° C.

Abstract: A support pedestal includes a support member including a resistive layer having a plurality of zones, a routing layer, and a plurality of conductive vias. The plurality of zones are defined by a plurality of independently controllable resistive heating elements. The resistive layer and the routing layer are disposed in different planes of the support member and are connected by the plurality of conductive vias.

Abstract: The present disclosure provides a support pedestal that includes a support member including a resistive layer having at least two zones, a routing layer, and a plurality of conductive vias. The resistive layer and the routing layer are disposed in different planes of the support member and are connected by the plurality of vias. The number of zones of the resistive layer is greater than or equal to a number of wires coupled to the routing layer. The routing layer may include a plurality of arm portions that extend from a central region of the routing layer. The support pedestal may further include a second resistive layer disposed along the same plane as the routing layer.

Abstract: A support pedestal includes a substrate, a plurality of resistive heating elements disposed on the substrate and defining a plurality of heating zones, and electric terminals disposed at a central region of the substrate. At least one of the electric terminals is connected to at least two of the plurality of resistive heating elements.

Abstract: A method for operating a heater system including a resistive heating element having a material with a non-monotonic resistivity vs. temperature profile is provided. The method includes heating the resistive heating element to within a limited temperature range in which the resistive heating element exhibits a negative dR/dT characteristic, operating the resistive heating element within an operating temperature range that at least partially overlaps the limited temperature range, and determining a temperature of the resistive heating element such that the resistive heating element functions as both a heater and a temperature sensor. The resistive heating element can function as a temperature sensor in a temperature range between about 500° C. and about 800° C., and the non-monotonic resistivity vs. temperature profile for the material of the resistive heating element can have a local maximum and a local minimum.

Abstract: A support pedestal is provided that includes a substrate having a top resistive layer defining a first set of zones and a bottom resistive layer defining a second set of zones. Each zone of the first and second set of zones is coupled to at least two electric terminals from among a plurality of electric terminals, and a total number of electric terminals is less than or equal to a total of the first and second set of zones.

Abstract: A heater includes a sintered assembly and a functional element disposed on one of opposing surfaces of the sintered assembly. The heater is manufactured by a method that includes hot pressing a ceramic powder and a plurality of first slugs and forming the sintered assembly including a ceramic substrate and the plurality of first slugs embedded therein, forming the functional element on the one opposing surface of the sintered assembly such that the functional element is connected to the plurality of first slugs, and forming a monolithic substrate in which the functional element and the plurality of first slugs are embedded.

Abstract: A method of constructing a heater includes the steps of forming a sintered assembly including a ceramic substrate and a plurality of first slugs embedded therein, forming a functional element on one of opposing surfaces of the sintered assembly such that the functional element is connected to the plurality of first slugs, and forming a monolithic substrate in which the functional element and the plurality of first slugs are embedded.

Abstract: An assembly includes a first member, a second member adjacent to the first member, and an aluminum material. At least one of the first member and the second member defines at least one trench. The aluminum material is disposed within the trench and bonds the first member to the second member along adjacent faces. A spacing between the first member and the second member along the adjacent faces is less than 5 ?m and a surface roughness of the adjacent faces of the first and second ceramic members is between 5 mm and 100 nanometers.

Abstract: A heater includes an aluminum nitride (AlN) substrate and a heating layer. The heating layer is made from a molybdenum material and is bonded to the AlN substrate via transient liquid phase bonding. The heater can also include a routing layer and a plurality of first conductive vias connecting the heating layer to the routing layer. The routing layer and the plurality of first conductive vias can be made from the molybdenum material and at least one of the routing layer and the plurality of first conductive vias are bonded to the AlN substrate via a transient liquid phase bond. A plurality of second conductive vias connecting the routing layer to a surface of the AlN substrate can be included and the plurality of second conductive vias are made of the molybdenum material and can be bonded to the AlN substrate via a transient liquid phase bond.

Abstract: A method of constructing an E-puck includes forming at least one trench into a lower substrate, depositing an electrode material onto the lower substrate and into the at least one trench, removing excess electrode material from the lower substrate to leave the electrode material within the at least one trench to form an electrode, and forming a dielectric on the lower substrate and the electrode such that the electrode is between the lower substrate and the upper substrate. Forming the at least one trench into the lower substrate forms at least one standoff portion adjacent to the at least one trench and the at least one standoff portion reduces dishing of the electrode material during removal of the excess electrode material from the lower substrate.

Abstract: An assembly includes a first member, a second member adjacent to the first member, and an aluminum material. At least one of the first member and the second member defines at least one trench. The aluminum material is disposed within the trench and bonds the first member to the second member along adjacent faces. In one form, a spacing between the first member and the second member along the adjacent faces is less than 5 ?m.

Abstract: A method for operating a heater system including a resistive heating element having a material with a non-monotonic resistivity vs. temperature profile is provided. The method includes heating the resistive heating element to within a limited temperature range in which the resistive heating element exhibits a negative dR/dT characteristic, operating the resistive heating element within an operating temperature range that at least partially overlaps the limited temperature range, and determining a temperature of the resistive heating element such that the resistive heating element functions as both a heater and a temperature sensor. The resistive heating element can function as a temperature sensor in a temperature range between about 500° C. and about 800° C., and the non-monotonic resistivity vs. temperature profile for the material of the resistive heating element can have a local maximum and a local minimum.

Abstract: A heater is provided that includes at least one resistive heating element having a material with a non-monotonic resistivity vs. temperature profile and exhibiting a negative dR/dT characteristic over a predetermined operating temperature range along the profile. The heater can include a plurality of circuits disposed in a fluid path to heat fluid flow.

Abstract: A method of joining is provided. the method includes preparing a first member, preparing a second member, and forming at least one trench in at least one of the first member and the second member. The method further includes placing a strip of solid aluminum material between the first member and the second member across the trench, bringing the first member and the second member together to contact the solid aluminum material and to form an assembly, and applying a force and heat to the assembly above a melting point of the solid aluminum material such that the solid aluminum material flows into the trench. Additionally, the method further includes applying additional heat to the assembly at or above a wetting temperature of the member in which the trench is formed to bond the first member to the second member along adjacent faces and cooling the assembly.

Abstract: A method of constructing a heater includes providing a substrate, forming at least one trench into the substrate, depositing a functional material onto the substrate and into the at least one trench to form a functional element, and providing an electrical termination in contact with the functional element.