Patents by Inventor Patrick MARKIEFKA

Patrick MARKIEFKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermally conductive adhesive
    Patent number: 10689551
    Abstract: The present invention relates to hotmelt adhesives with improved thermal conductivity, uses thereof and methods for the manufacture of articles with improved thermal conductivity using said adhesive compositions. The adhesive compositions of the invention comprise at least one (co)polymer binder and combination of different fillers, as defined herein.
    Type: Grant
    Filed: September 5, 2017
    Date of Patent: June 23, 2020
    Assignee: HENKEL AG & CO. KGAA
    Inventors: Ruediger Butterbach, Patrick Markiefka, Carsten Schubert, Judith Siepenkothen, Siegfried Kopannia
  • FOAMABLE HOT MELT ADHEISVE COMPOSITIONS AND USE THEREOF
    Publication number: 20190270917
    Abstract: The invention relates to a foamable hot melt adhesive composition, method of foaming the foamable hot melt adhesive composition, and method of using the foamed hot melt adhesive composition. The foamed hot melt adhesive provides a reliable adhesion with high heat resistance for packaging applications. The present invention provides an environmentally and economically sound adhesive that provides sufficient adhesion to the packages upon which it is being applied.
    Type: Application
    Filed: May 20, 2019
    Publication date: September 5, 2019
    Inventors: Richard ELLIS, Dirk KASPER, Patrick MARKIEFKA, David DUCKWORTH, Jonas STABEL, Stephane BELMUDES, Patrick HAYES, Andrea EODICE, Andrew Gold
  • Foamable hot melt adhesive compositions and use thereof
    Patent number: 10336920
    Abstract: The invention relates to a foamable hot melt adhesive composition, method of foaming the foamable hot melt adhesive composition, and method of using the foamed hot melt adhesive composition. The foamed hot melt adhesive provides a reliable adhesion with high heat resistance for packaging applications. The present invention provides an environmentally and economically sound adhesive that provides sufficient adhesion to the packages upon which it is being applied.
    Type: Grant
    Filed: July 23, 2015
    Date of Patent: July 2, 2019
    Assignees: HENKEL AG & CO. KGAA, HENKEL IP & HOLDING GMBH
    Inventors: Richard Ellis, Dirk Kasper, Patrick Markiefka, David Duckworth, Jonas Stabel, Stephane Belmudes, Patrick Hayes, Andrea Eodice
  • THERMALLY CONDUCTIVE ADHESIVE
    Publication number: 20170362473
    Abstract: The present invention relates to hotmelt adhesives with improved thermal conductivity, uses thereof and methods for the manufacture of articles with improved thermal conductivity using said adhesive compositions. The adhesive compositions of the invention comprise at least one (co)polymer binder and combination of different fillers, as defined herein.
    Type: Application
    Filed: September 5, 2017
    Publication date: December 21, 2017
    Inventors: Ruediger BUTTERBACH, Patrick MARKIEFKA, Carsten SCHUBERT, Judith SIEPENKOTHEN, Siegfried KOPANNIA
  • FOAMABLE HOT MELT ADHESIVE COMPOSITIONS AND USE THEREOF
    Publication number: 20150322301
    Abstract: The invention relates to a foamable hot melt adhesive composition, method of foaming the foamable hot melt adhesive composition, and method of using the foamed hot melt adhesive composition. The foamed hot melt adhesive provides a reliable adhesion with high heat resistance for packaging applications. The present invention provides an environmentally and economically sound adhesive that provides sufficient adhesion to the packages upon which it is being applied.
    Type: Application
    Filed: July 23, 2015
    Publication date: November 12, 2015
    Inventors: Richard ELLIS, Dirk KASPER, Patrick MARKIEFKA, David DUCKWORTH, Jonas STABEL, Stephane BELMUDES, Patrick HAYES, Andrea EODICE