Abstract: A sputtering chamber has a rotating cylindrical sputtering target inside a vacuum enclosure. An anode is positioned next to the target, having an outer copper pipe, a magnetic core axially located within the copper pipe, and liquid cooling channels formed between the magnetic core and the outer copper pipe. A shield is positioned to block line-of-sight from the plasma to the anode, the shield shaped as a half pipe exposing surface of the copper pipe in a direction away from the plasma.

Abstract: Methods for manufacturing rotary target materials that allow a material to be cast in a melting zone of a casting vessel while the vessel is rotated such that a melting zone is below a casting zone. The vessel is sealed and the pressure inside the vessel is reduced and the exterior of the vessel is heated. The melting zone of the vessel is heated to a temperature that melts the material and releases any trapped gasses which can be pumped out using the vacuum pump. Once the melting zone and molten material have reached a specified temperature, outgassed, and the casting zone has reached a temperature to maximize adhesion and reduce voids and defects, the vessel is rotated until the melting zone is directly above the casting zone to transfer the material from the melting zone to the casting zone.

Abstract: The present disclosure provides a sputtering process comprising the steps of ionizing a process gas with a laser to form an ionized process gas and accelerating the ionized process gas into a target material surface using an electric field generated by at least one electrode.

Abstract: The present disclosure provides systems and methods of controlling a magnetically confined plasma sputtering process using the waste heat transferred from the plasma into the target material and then into thermally controlled magnetic field adjustment assemblies that modify the strength of the plasma confinement magnetic fields on the target material.

Abstract: The present disclosure relates to systems and methods of additive manufacturing that reduce or eliminates defects in the bulk deposition material microstructure resulting from the additive manufacturing process. An additive manufacturing system comprises evaporating a deposition material to form an evaporated deposition material and ionizing the evaporated deposition material to form an ionized deposition material flux. After forming the ionized deposition material flux, the ionized deposition material flux is directed through an aperture, accelerated to a controlled kinetic energy level and deposited onto a surface of a substrate. The aperture mechanism may comprise a physical, electrical, or magnetic aperture mechanism. Evaporation of the deposition material may be performed with an evaporation mechanism comprised of resistive heating, inductive heating, thermal radiation, electron heating, and electrical arc source heating.

Abstract: Methods for manufacturing rotary target materials that allows a material to be cast in a melting zone of a casting vessel while the vessel is rotated such that a melting zone is below a casting zone. The vessel is sealed and the pressure inside the vessel is reduced and the exterior of the vessel is heated. The melting zone of the vessel is heated to a temperature that melts the material and releases any trapped gasses which can be pumped out using the vacuum pump. Once the melting zone and molten material have reached a specified temperature, outgassed, and the casting zone has reached a temperature to maximize adhesion and reduce voids and defects, the vessel is rotated until the melting zone is directly above the casting zone to transfer the material from the melting zone to the casting zone.

Abstract: The present disclosure provides systems and methods of controlling a magnetically confined plasma sputtering process using the waste heat transferred from the plasma into the target material and then into thermally controlled magnetic field adjustment assemblies that modify the strength of the plasma confinement magnetic fields on the target material.

Abstract: The present disclosure relates to systems and methods of additive manufacturing that reduce or eliminates defects in the bulk deposition material microstructure resulting from the additive manufacturing process. An additive manufacturing system comprises evaporating a deposition material to form an evaporated deposition material and ionizing the evaporated deposition material to form an ionized deposition material flux. After forming the ionized deposition material flux, the ionized deposition material flux is directed through an aperture, accelerated to a controlled kinetic energy level and deposited onto a surface of a substrate. The aperture mechanism may comprise a physical, electrical, or magnetic aperture mechanism. Evaporation of the deposition material may be performed with an evaporation mechanism comprised of resistive heating, inductive heating, thermal radiation, electron heating, and electrical arc source heating.