Patents by Inventor Patrick Neel Stover

Patrick Neel Stover has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SOLDER GRID ARRAY FOR ATTACHMENT OF A DIE PACKAGE
    Publication number: 20230197659
    Abstract: A die package comprises a substrate comprising a solder pad element, a semiconductor die coupled to the substrate, a solder layer comprising a first solder material deposited on the solder pad element, the first solder material having a first melting temperature, and an interconnect ball comprising a second solder material deposited on the solder layer, the second solder material having a second melting temperature that is less than the first melting temperature.
    Type: Application
    Filed: December 20, 2021
    Publication date: June 22, 2023
    Inventors: Mukund Ayalasomayajula, Dinesh Padmanabhan Ramalekshmi Thanu, Rui Zhang, Xiao Lu, Robert Nickerson, Patrick Neel Stover