Abstract: In described examples, a method includes receiving light from a field of view on a spatial light modulator that includes a two-dimensional array of picture elements in rows and columns; and determining a portion of the two-dimensional array that corresponds to a region of interest in response to a transmit scan beam illuminating the field of view. The method also includes directing light from the portion of the two-dimensional array to a photodiode, and directing light outside the portion away from the photodiode.

Abstract: A micromirror array 110 fabricated on a semiconductor substrate 11. The array 110 is comprised of three operating layers 12, 13, 14. An addressing layer 12 is fabricated on the substrate. A hinge layer 13 is spaced above the addressing layer 12 by an air gap. A mirror layer 14 is spaced over the hinge layer 13 by a second air gap. The hinge layer 13 has a hinge 13a under and attached to the mirror 14a, the hinge 13a permitting the mirror 14a to tilt. The hinge layer 13 further has spring tips 13c under the mirror 14a, which are attached to the addressing layer 12. These spring tips 13c provide a stationary landing surface for the mirror 14a.

Abstract: System and method for storing energy using electromechanically active materials in micro electromechanical systems. A preferred embodiment comprises a movable element, an intermediate layer formed under the movable element, and electrical addressing circuitry formed under the intermediate layer. The intermediate layer contains a hinge and at least one flexible member associated with the movable element, with the flexible member comprising a layer made from an electromechanically active material. The electromechanically active material contracts or deforms when an electric field is applied, helping the movable element move from a first position to a second position. The use of the electromechanically active material enables the flexible member to apply a greater force on the movable element to help the movable element overcome stiction.

Abstract: A micromirror array 110 fabricated on a semiconductor substrate 11. The array 110 is comprised of three operating layers 12, 13, 14. An addressing layer 12 is fabricated on the substrate. A hinge layer 13 is spaced above the addressing layer 12 by an air gap. A mirror layer 14 is spaced over the hinge layer 13 by a second air gap. The hinge layer 13 has a hinge 13a under and attached to the mirror 14a, the hinge 13a permitting the mirror 14a to tilt. The hinge layer 13 further has spring tips 13c under the mirror 14a, which are attached to the addressing layer 12. These spring tips 13c provide a stationary landing surface for the mirror 14a.