Abstract: A linear chemical mechanical planarization (CMP) system includes a belt pad, a slurry bar having a plurality of nozzles, and a heating module for heating slurry. The heating module has a plurality of heating elements, each of which is coupled in flow communication with one of the plurality of nozzles of the slurry bar. The system also may include a control system for controlling the heating elements of the heating module and first and second temperature sensors coupled to the control system. The first temperature sensors measure the temperature of slurry heated by each of the heating elements, and the second temperature sensors measure the temperature of the surface of the belt pad. A method for dispensing slurry in a linear CMP system, and methods for controlling the temperature of the surface of the belt pad and the temperature of slurry in a linear CMP system also are described.

Abstract: A liquid dispense manifold having drip nozzles configured to form controlled droplets is provided for use in chemical-mechanical polisher (CMP) systems. The liquid dispense manifold includes a plurality of drip nozzles that are secured to the side of the liquid dispense manifold. Each of the plurality of drip nozzles has a passage defined between a first end and a second end. A bend is defined within the drip nozzle passage such that droplets are directed downward toward a polishing surface. The nozzles are configured with respect to the manifold to provide an even flow rate of substantially uniform drops onto the polishing surface.

Abstract: In a method for making a stainless steel reinforced belt pad for linear chemical mechanical planarization (CMP), a stainless steel band is disposed around an inner mold having positioners configured to hold the stainless steel band in place during a molding process. Once the stainless steel band is disposed around the inner mold, pad material is injected into the gap defined between the outer mold and the stainless steel band. An inner mold for making a stainless steel reinforced belt pad for linear CMP includes a cylindrical body and a plurality of positioners affixed to the cylindrical body. The plurality of positioners is arranged so as to hold a stainless steel band disposed around the cylindrical body in place during a molding process. By way of example, suitable positioners include spring-loaded ball plungers.

Abstract: An optical window structure for use in chemical mechanical planarization is provided. The optical window structure includes a polishing pad and an optical window opening in the polishing pad. The optical window structure also includes a molded optical window attached to an underside of the polishing pad, a molded portion of the optical window at least partially protruding into the optical window opening in the polishing pad.