Abstract: Methods for analyzing and altering the operation of a semiconductor device are provided. The methods include exposing an area of a semiconductor device through a selective partial etch process that creates a skeleton-like structure of metal traces. The exposed areas impose minimal invasiveness to the functionality of the device. The exposed area can facilitate probing the semiconductor device with analysis methods that provide information about the operation of the semiconductor device. Additional device functionality alteration is achieved by cutting, connecting, and re-routing interconnect layers.

Abstract: Embodiments described herein may be related to apparatuses, processes, systems, and/or techniques for an enclosure, which may be referred to as a cartridge, that surrounds a semiconductor device prior to the semiconductor device being bombarded with an electron beam during operational testing. In embodiments, the enclosure may include a cooling plate that includes a thermal cooling mechanism that is thermally coupled with the semiconductor device to control the temperature of the semiconductor device during testing. The thermal cooling mechanism may include a manifold that extends through the plate through which a cooled fluid, cooled air, or some other cool material may be circulated to cool the semiconductor device. Other embodiments may be described and/or claimed.

Abstract: Embodiments described herein may be related to apparatuses, processes, systems, and/or techniques for using x-rays to alter or observe circuits within a semiconductor device before, during or after a test of the semiconductor device. Other embodiments may be described and/or claimed.

Abstract: An apparatus comprising a beam emitter to emit a beam comprising electrons, ions or laser-light photons toward a target substrate. A motion sensor to detect mechanical vibrations of the target substrate. The motion sensor is mechanically coupled to the target substrate, a processor coupled to an output of the motion sensor. The processor is to generate a vibration correction signal proportional to the mechanical vibrations detected by the motion sensor, and beam steering optics coupled to the processor. The beam steering optics are to deflect the beam according to the vibration correction signal to compensate for the mechanical vibrations of the target substrate.

Abstract: An apparatus comprising a beam emitter to emit a beam comprising electrons, ions or laser-light photons toward a target substrate. A motion sensor to detect mechanical vibrations of the target substrate. The motion sensor is mechanically coupled to the target substrate, a processor coupled to an output of the motion sensor. The processor is to generate a vibration correction signal proportional to the mechanical vibrations detected by the motion sensor, and beam steering optics coupled to the processor. The beam steering optics are to deflect the beam according to the vibration correction signal to compensate for the mechanical vibrations of the target substrate.

Abstract: A probe assembly for analyzing a test device that includes a housing with an electron source disposed therein for emitting primary electrons. A photon source is positioned to emit photons that strike the electron source such that when the photons strike the electron source, the electron source emits the primary electrons. Detection circuitry is provided that is configured to detect secondary electrons emitted from a test device of a test assembly and to form an excitation waveform.