Abstract: Electronic modules having complex contact structures may be formed by encapsulating panels containing pluralities of electronic modules delineated by cut lines and having conductive interconnects buried within the panel along the cut lines. Holes defining contact regions along the electronic module sidewall may be cut into the panel along the cut lines to expose the buried interconnects. The panel may be metallized, e.g. by a series or processes including plating, on selected surfaces including in the holes to form the contacts and other metal structures followed by cutting the panel along the cut lines to singulate the individual electronic models. The contacts may be located in a conductive grove providing a castellated module.

Abstract: Electronic modules having complex contact structures may be formed by encapsulating panels containing pluralities of electronic modules delineated by cut lines and having conductive interconnects buried within the panel along the cut lines. Holes defining contact regions along the electronic module sidewall may be cut into the panel along the cut lines to expose the buried interconnects. The panel may be metallized, e.g. by a series or processes including plating, on selected surfaces including in the holes to form the contacts and other metal structures followed by cutting the panel along the cut lines to singulate the individual electronic models. The contacts may be located in a conductive grove providing a castellated module.

Abstract: Electronic modules having complex contact structures may be formed by encapsulating panels containing pluralities of electronic modules delineated by cut lines and having conductive interconnects buried within the panel along the cut lines. Holes defining contact regions along the electronic module sidewall may be cut into the panel along the cut lines to expose the buried interconnects. The panel may be metallized, e.g. by a series or processes including plating, on selected surfaces including in the holes to form the contacts and other metal structures followed by cutting the panel along the cut lines to singulate the individual electronic models. The contacts may be located in a conductive grove providing a castellated module.

Abstract: The present invention relates generally to an oxidation and corrosion resistant coating composition produced by a vapor phase co-deposition of transition metals on metallic components. In particular, this coating includes aluminum and silicon and the coated substrate may comprise precious metal, nickel, cobalt or MCrALY. Such coatings are particularly useful in protecting nickel and cobalt and iron-based superalloys from heat corrosion and oxidation attack, especially during high temperature operation, e.g., gas turbine and jet engine hot zones.

Abstract: The present invention relates generally to an oxidation and corrosion resistant coating composition produced by a vapor phase co-deposition of transition metals on metallic components. In particular, this coating includes aluminum and silicon and the coated substrate may comprise precious metal, nickel, cobalt or MCrALY. Such coatings are particularly useful in protecting nickel and cobalt and iron-based superalloys from heat corrosion and oxidation attack, especially during high temperature operation, e.g., gas turbine and jet engine hot zones.

Abstract: Coated nickel, cobalt or nickel-cobalt superalloy bodies having increased resistance to oxidation, corrosion and thermal fatigue at high temperature are produced by applying a thin layer of a platinum-group metal, siliciding and heating to an elevated temperature to diffuse and integrate the silicided platinum-group metal into the surface of the superalloy body. Then the superalloy body is exposed to a diffusion powder composition containing sources of aluminum or aluminum/chromium metals and heated in a hydrogen or inert gas atmosphere to an elevated temperature to codeposit and diffuse aluminum or aluminum and chromium into the silicided platinum-group metal-treated surface layer.

Abstract: Process for producing novel coated nickel and/or cobalt superalloy bodies having increased resistance to oxidation, corrosion and thermal fatigue at high temperatures. The process comprises applying a thin layer of a platinum-group metal, siliciding and heating to an elevated temperature to diffuse and integrate the silicided platinum-group metal into the surface of the superalloy body. Then the superalloy body is exposed to a diffusion powder composition containing sources of aluminum or aluminum/chromium metals and heated in a hydrogen or inert gas atmosphere to an elevated temperature to codeposit and diffuse aluminum or aluminum and chromium into the silicided platinum-group metal-treated surface. Finally, the superalloy body is heated to its solvus temperature to form a ductile surface having an outer zone comprising a platinum-group metal aluminide, optionally ductilized by the solutioning therein of beta chromium.