Abstract: An arrangement for concurrently powering a plurality of sputtering sources. A power supply is coupled to a charge accumulator. The charge accumulator is coupled to several sputtering sources via switching devices. The duty cycle of each switching device is used to individually control the power delivered to each sputtering source. In another arrangement, a power source is coupled to an impedance match circuit. The impedance match circuit is coupled to several sputtering sources via several balance elements. Each balance element is operated to individually control the power delivered to the sputtering source.

Abstract: A sputtering source has a magnetron and a target. Control magnets are provided about the target to modify the magnetic lines of the magnetron. A sputtering source has several magnetrons, each having a respective target. A plasma/sputtering shield is provided in front of the targets. The shield has several windows, each aligned with one of the targets. Magnets are provided on the shield to control the magnetic lines of the magnetrons.