Abstract: A method and apparatus for processing a surface of a substrate with a cluster apparatus including a transport chamber and two or more process reactors connected to the transport chamber. The method further includes subjecting the surface of the substrate to a surface preparation step for providing a prepared substrate surface, providing an interface layer on the prepared substrate surface of the substrate for forming an interfaced substrate surface, and providing a functional layer on the interfaced substrate surface of the substrate. The process steps are carried out in at least two different process reactors connected to transport chamber the substrate is transported between the at least two process reactors via the transport chamber under vacuum atmosphere.

Abstract: A system for treating an object with plasma includes a vacuum processing chamber having a holder on which the object to be treated is placed, at least two subassemblies each including at least one plasma source able to generate a plasma and being supplied with radio-frequency power Pi and with a gas i of independent flow rate ni. The plasma generated by one of the subassemblies is a partially ionized gas or gas mixture of different chemical nature from the plasma generated by the other subassembly or subassemblies. A process for selectively treating a composite object employing such a device is described.

Abstract: A system for treating an object with plasma includes a vacuum processing chamber having a holder on which the object to be treated is placed, at least two subassemblies each including at least one plasma source able to generate a plasma and being supplied with radio-frequency power Pi and with a gas i of independent flow rate ni. The plasma generated by one of the subassemblies is a partially ionized gas or gas mixture of different chemical nature from the plasma generated by the other subassembly or subassemblies. A process for selectively treating a composite object employing such a device is described.

Abstract: A system for treating an object with plasma includes a vacuum processing chamber having a holder on which the object to be treated is placed, at least two subassemblies each including at least one plasma source able to generate a plasma and being supplied with radio-frequency power Pi and with a gas i of independent flow rate ni. The plasma generated by one of the subassemblies is a partially ionized gas or gas mixture of different chemical nature from the plasma generated by the other subassembly or subassemblies. A process for selectively treating a composite object employing such a device is described.

Abstract: A method of manufacturing a hetero-junction bipolar transistor, especially of gallium arsenide, comprising the step of forming superimposed epitaxial layers for forming a collector layer (1) of the n.sup.+ type, an emitter layer (3) of the n-type, the formation of localized implantations of the p.sup.+ type to obtain the base regions (31,30) or of the n.sup.+ type to obtain collector contact islands (20). This method also includes the formation by a controlled etching into a germanium layer (50) formed at the surface of these layers, of pads having a profile such that their tips define with a very high precision openings (E.sub.1), of which the distance (E.sub.0) between the edges defines the emitter contact region, while their edges have a concavity turned towards the exterior of the device.Application integrated circuits on gallium arsenide.

Abstract: A method, in which the formation of a first metallization level (a) is followed by the deposition of a first and a second isolating layer (b and c), by a selective etching step of the second isolating layer with respect to the first layer (d), the planarization of the structure thus obtained by a sacrificial layer and by the etching of this sacrificial layer down to the level of the second isolating layer (f), the selective etching step between these different layers so as to merge at the first metallization level with respect to a metallization and to ensure simultaneously the isolation between metallization levels with respect to a crossing (g) and finally the formation of the second metallization level (h). This method of quasi self-alignment eliminates a photo-lithographic step and ensures a substantial increase in integration density and in reliability of the circuit.