Patents by Inventor Patrick Ridgeway

Patrick Ridgeway has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and device for cooling soldered printed circuit boards
    Patent number: 9936569
    Abstract: Method for cooling soldered printed circuit board modules in a cooling zone of a soldering system, wherein at least one cooling gas comprising inert gas is introduced into the cooling zone, wherein the printed circuit boards are conveyed continuously from a soldering zone of the soldering system into the cooling zone, wherein the cooling gas is generated using liquid cooling gas. The method according to the invention and the device (1) according to the invention advantageously permit highly efficient cooling of printed circuit board modules after the soldering process. The cooling gas may advantageously be used for inerting the soldering system (2) after extraction from the cooling zone (15).
    Type: Grant
    Filed: October 22, 2012
    Date of Patent: April 3, 2018
    Assignee: L'Air Liquide, Soci§té Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude
    Inventors: Holger Liebert, Patrick Ridgeway, Andre Kast, Laurent Coudurier
  • METHOD AND DEVICE FOR COOLING SOLDERED PRINTED CIRCUIT BOARDS
    Publication number: 20140290286
    Abstract: Method for cooling soldered printed circuit board modules in a cooling zone of a soldering system, wherein at least one cooling gas comprising inert gas is introduced into the cooling zone, wherein the printed circuit boards are conveyed continuously from a soldering zone of the soldering system into the cooling zone, wherein the cooling gas is generated using liquid cooling gas. The method according to the invention and the device (1) according to the invention advantageously permit highly efficient cooling of printed circuit board modules after the soldering process. The cooling gas may advantageously be used for inerting the soldering system (2) after extraction from the cooling zone (15).
    Type: Application
    Filed: October 22, 2012
    Publication date: October 2, 2014
    Inventors: Holger Liebert, Patrick Ridgeway, Andre Kast, Laurent Coudurier