Abstract: A method for producing a micro-LED matrix by (A) depositing an LED layer structure onto a working substrate; (B) singulating a plurality of LED structures from the LED layer structure on the working substrate; (C) applying a first contact-making structure to a carrier substrate; and (D) transferring the plurality of LED structures from the working substrate to the carrier substrate by bonding and laser lift-off. An at least two-layered carrier substrate is used, including a carrier layer and a first flexible polymer layer, in step C the first contact-making structure is applied indirectly or directly to a side of the first polymer layer which faces away from the carrier layer, and in an additional method step D-0 between method steps C and D, a second flexible polymer layer is formed at least between the singulated LED structures. A micro-LED matrix and use are also provided.

Abstract: A magnetic field sensor having a Hall sensor with a first terminal contact and with a second terminal contact and with a third terminal contact and with a fourth terminal contact and with a fifth terminal contact, whereby a first switch with a control input is provided between the first terminal contact and the fifth terminal contact, and the first switch connects or disconnects the first terminal contact to/from the fifth terminal contact, and a control unit is provided and the control unit is connected to the control input of the first switch.

Abstract: An image forming apparatus includes: a different apparatus detecting section that detects one or more different image forming apparatuses present on a network; an apparatus capability acquisition section that acquires printing capabilities of the different image forming apparatuses; an apparatus selecting section that selects, based on the acquired printing capabilities, at least one different image forming apparatus having a printing capability equivalent to or higher than the present image forming apparatus as an alternative apparatus; a control section that executes a print job; and a print job transfer sections that, when the control section cannot execute the print job, transfers the print job to the alternative apparatus, wherein when the print job transfer section completes the transfer of the print job to the alternative apparatus, the control section allows a display section to display information indicating that the print job has been transferred and a destination for the transfer.

Abstract: A three-dimensional Hall sensor can be used for detecting a spatial magnetic field. A method for measuring a spatial magnetic field can be performed using this Hall sensor. The Hall sensor comprises an electrically conducting base body and at least three electrode pairs, wherein each electrode pair has a first terminal and a second terminal, which are arranged such on the base body, that a current can flow from the first terminal to the second terminal through the base body. At least three first terminals are arranged on a first surface of the base body and at least three second terminals are arranged on the second surface, different from the first surface of the base body, wherein the first and the second surfaces oppose each other.

Abstract: A Hall sensor is provided having a first Hall element with a first terminal contact and with a second terminal contact and with a third terminal contact, a second Hall element with a fourth terminal contact and with a fifth terminal contact and with a sixth terminal contact, a third Hall element with a seventh terminal contact and with an eighth terminal contact and with a ninth terminal contact, and a fourth Hall element with a tenth terminal contact and with an eleventh terminal contact and with a twelfth terminal contact. The first Hall element and the second Hall element and the third Hall element and the fourth Hall element are connectable in series.

Abstract: A force sensor comprising a substrate, a semiconductor body, and a piezoresistive element provided on a top surface of the semiconductor body. The semiconductor body is connected to the substrate in a force-fit manner, and includes a first wing which is provided on the top surface of the semiconductor body and being connected to the semiconductor body in a force-fit manner. A first force application area is provided on the first wing. A second wing has a second force application area provided opposite the first wing. The piezoresistive element is disposed between the first wing and the second wing. A force distribution component is connected to the first force application area and the second force application area in a force-fit manner. The force distribution component having a first surface which is oriented away from the top surface of the semiconductor body and includes a third force application area.

Abstract: A magnetic field sensor is provided, having a first Hall sensor with a first terminal contact and with a second terminal contact and with a third terminal contact and with a fourth terminal contact and with a fifth terminal contact, and a second Hall sensor with a sixth terminal contact and with a seventh terminal contact and with an eighth terminal contact and with a ninth terminal contact and with a tenth terminal contact, whereby the first terminal contact is connected to the fifth terminal contact and to the sixth terminal contact and to the tenth terminal contact, and the second terminal contact is connected to the ninth terminal contact, and the fourth terminal contact is connected to the seventh terminal contact.

Abstract: A three-dimensional Hall sensor can be used for detecting a spatial magnetic field. A method for measuring a spatial magnetic field can be performed using this Hall sensor. The Hall sensor comprises an electrically conducting base body and at least three electrode pairs, wherein each electrode pair has a first terminal and a second terminal, which are arranged such on the base body, that a current can flow from the first terminal to the second terminal through the base body. At least three first terminals are arranged on a first surface of the base body and at least three second terminals are arranged on the second surface, different from the first surface of the base body, wherein the first and the second surfaces oppose each other.

Abstract: A method for producing a micro-LED matrix by (A) depositing an LED layer structure onto a working substrate; (B) singulating a plurality of LED structures from the LED layer structure on the working substrate; (C) applying a first contact-making structure to a carrier substrate; and (D) transferring the plurality of LED structures from the working substrate to the carrier substrate by bonding and laser lift-off. An at least two-layered carrier substrate is used, including a carrier layer and a first flexible polymer layer, in step C the first contact-making structure is applied indirectly or directly to a side of the first polymer layer which faces away from the carrier layer, and in an additional method step D-0 between method steps C and D, a second flexible polymer layer is formed at least between the singulated LED structures. A micro-LED matrix and use are also provided.

Abstract: A probe for recording and/or stimulating brain activity includes a connecting portion and at least one shank extending from the connecting portion. The at least one shank includes a first side, a second side opposed to the first side, and a fin protruding substantially perpendicularly from the second side and running on at least a part of a length of the at least one shank. The first side includes at least one recording and/or stimulating site.

Abstract: A force sensor comprising a substrate, a semiconductor body, and a piezoresistive element provided on a top surface of the semiconductor body. The semiconductor body is connected to the substrate in a force-fit manner, and includes a first wing which is provided on the top surface of the semiconductor body and being connected to the semiconductor body in force-fitting manner. A first force application area is provided on the first wing. A second wing has a second force application area provided opposite the first wing. The piezoresistive element is disposed between the first wing and the second wing. A force distribution component is connected to the first force application area and the second force application area in a force-fit manner. The force distribution component having a first surface which is oriented away from the top surface of the semiconductor body and includes a third force application area.

Abstract: A magnetic field sensor having a Hall sensor with a first terminal contact and with a second terminal contact and with a third terminal contact and with a fourth terminal contact and with a fifth terminal contact, whereby a first switch with a control input is provided between the first terminal contact and the fifth terminal contact, and the first switch connects or disconnects the first terminal contact to/from the fifth terminal contact, and a control unit is provided and the control unit is connected to the control input of the first switch.

Abstract: A Hall sensor is provided having a first Hall element with a first terminal contact and with a second terminal contact and with a third terminal contact, a second Hall element with a fourth terminal contact and with a fifth terminal contact and with a sixth terminal contact, a third Hall element with a seventh terminal contact and with an eighth terminal contact and with a ninth terminal contact, and a fourth Hall element with a tenth terminal contact and with an eleventh terminal contact and with a twelfth terminal contact. The first Hall element and the second Hall element and the third Hall element and the fourth Hall element are connectable in series.

Abstract: A magnetic field sensor is provided, having a first Hall sensor with a first terminal contact and with a second terminal contact and with a third terminal contact and with a fourth terminal contact and with a fifth terminal contact, and a second Hall sensor with a sixth terminal contact and with a seventh terminal contact and with an eighth terminal contact and with a ninth terminal contact and with a tenth terminal contact, whereby the first terminal contact is connected to the fifth terminal contact and to the sixth terminal contact and to the tenth terminal contact, and the second terminal contact is connected to the ninth terminal contact, and the fourth terminal contact is connected to the seventh terminal contact.

Abstract: In a process for assembling a microstructure (1), provision is made of a first microstructure piece (2) having a receiving recess (3) in its surface and a second microstructure piece (5) having a connecting region (6) fitting into the receiving recess (3) and on which is arranged at least one electrical contact element (7a, 7b). Provision is made of a flexible cable (8) having a flat substrate layer (9) made of an electrically insulating material and at least one strip conductor (10) arranged thereon. The cable (8) has at least one tongue (14a, 14b) on which is arranged at least one counter-contact element (11a, 11b) connected to the strip conductor (10). The cable (8) and the microstructure pieces (5) are positioned relative to each other in a preassembly position in which the connecting region (6) is opposite the receiving recess (3) and the tongue (14a, 14b) is aligned between the connecting region (6) and the receiving recess (3).

Abstract: A method for producing an electrical and mechanical connection, wherein a solid body comprises a support, on which is disposed an electrical contact zone and an electrically insulating support zone. A flexible, flat cable comprises a support layer made of an electrically insulating material and a strip conductor, with an electrical contacting point and a laterally adjacent insulating cable zone. An adhesive layer is applied on the cable and the contacting point is disposed on the support layer so that the adhesive layer surrounds the contacting point and adheres to the cable. The support and the cable are positioned in a pre-assembly position so that the contacting point of the cable is facing the contact zone of the support and the adhesive layer is facing the electrically insulating support zone. The solid body and the cable are positioned so that the contacting point electrically contacts the contact zone and the adhesive layer adheres to the surface of the solid body.

Abstract: In the present disclosure a device for sensing and/or actuation purposes is presented in which microstructures (20) comprising shafts (2) with different functionality and dimensions can be inserted in a modular way. That way, out-of-plane connectivity, mechanical clamping between the microstructures (20) and a substrate (1) of the device, and electrical connection between electrodes (5) on the microstructures (20) and the substrate (1) can be realized. Connections to external circuitry can be realised. Microfluidic channels (10) in the microstructures (20) can be connected to external equipment. A method to fabricate and assemble the device is provided.

Abstract: In the present disclosure a device for sensing and/or actuation purposes is presented in which microstructures (20) comprising shafts (2) with different functionality and dimensions can be inserted in a modular way. That way, out-of-plane connectivity, mechanical clamping between the microstructures (20) and a substrate (1) of the device, and electrical connection between electrodes (5) on the microstructures (20) and the substrate (1) can be realized. Connections to external circuitry can be realised. Microfluidic channels (10) in the microstructures (20) can be connected to external equipment. A method to fabricate and assemble the device is provided.

Abstract: An optical axis conversion lens includes an incident surface on which the light emerging from a slab light guide is incident, a cylindrical lens surface which has an optical axis C in a position or direction different from an optical axis A of the light incident on the incident surface and which converges the light in the direction of the optical axis C, a first internal reflection mirror which changes the direction of the incident light from the incident surface to an optical axis B, and a second internal reflection mirror which changes light on optical axis B to an optical axis C. By such an arrangement, it is possible to convert light on the optical axis A to the optical axes B and C without being limited by the height of the slab light guide and to form a narrow beam even at a position far away from the slab light guide.

Abstract: An optical position detector having an excellent detection characteristic at long measurement distance is achieved by a structure including an input optical fiber, output optical fibers, a slab light guide which is disposed on a substrate and has a branched light guide, a first cylindrical lens which converts an optical path of light emerging from the slab light guide and which condenses the light on a surface to be detected, and a second cylindrical lens which converts an optical path of light reflected from the surface to be detected and which guides the light to the slab light guide.