Patents by Inventor Patrick S. Johnson
Patrick S. Johnson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250032007Abstract: Systems and methods are provided to provide guidance to a user regarding management of a physiologic condition such as diabetes. The determination may be based upon a patient glucose concentration level. The glucose concentration level may be provided to a stored model to determine a state. The guidance may be determined based at least in part on the determined state.Type: ApplicationFiled: October 11, 2024Publication date: January 30, 2025Inventors: Alexandra Elena CONSTANTIN, Scott M. BELLIVEAU, Naresh C. BHAVARAJU, Jennifer D. BLACKWELL, Eric S. COHEN, Basab DATTARAY, Anna Leigh DAVIS, Rian W. DRAEGER, Arturo GARCIA, John Michael GRAY, Hari HAMPAPURAM, Nathaniel David HEINTZMANN, Lauren Hruby JEPSON, Matthew Lawrence JOHNSON, Apurv Ullas KAMATH, Katherine Yerre KOEHLER, Phil MAYOU, Patrick Wile MCBRIDE, Michael Robert MENSINGER, Sumitaka MIKAMI, Andrew Attila PAL, Nicholas POLYTARIDIS, Philip Thomas PUPA, Eli REIHMAN, Peter C. SIMPSON, Tomas C. WALKER, Daniel Justin WIEDEBACK, Subrai Girish PAI, Matthew T. VOGEL
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Patent number: 9483084Abstract: A frictional hinge assembly for use with electronics devices such as computer notebooks having base and lid portions may present a higher level of frictional resistance to rotation in one direction than in the other. The hinge may comprise a base-mounted helical sleeve having loops that embrace a rotational shaft that is connected to a lid. As the lid is opened, the rotation of the shaft may cause the loops of the helical sleeve to tighten and thereby generate frictional forces, which requires a greater opening force to overcome than when the lid is being closed, in which case the loops loosen. The helical hinge may have applicability for notebook computers, electronic devices having clamshell form factors, all-in-one designs and tablets using kickstands and the like.Type: GrantFiled: September 27, 2013Date of Patent: November 1, 2016Assignee: Intel CorporationInventors: Patrick S. Johnson, Russell S. Aoki
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Patent number: 9354668Abstract: In one embodiment chassis for an electronic device comprises a first section and a second section and an assembly to connect the first section of the chassis to the second section of the chassis for an electronic device, comprising a first hinge assembly to be coupled to the first section of the chassis for the electronic device, a second hinge assembly to be coupled to the second section of the chassis for the electronic device, a first rigid connecting member to be coupled to the first hinge assembly and the second hinge assembly, a first resistance element to provide a first rotational resistance between the first hinge assembly and a first end of the first rigid connecting member and a first resistance element to provide a second rotational resistance between the second hinge assembly and a second end of the first rigid connecting member. Other embodiments may be described.Type: GrantFiled: July 30, 2013Date of Patent: May 31, 2016Assignee: Intel CorporationInventors: Tod A. Byquist, Peter Bristol, Michael S. Brazel, Kristin L. Weihl, Stella Latscha, Alexander D. Williams, Nicolas Kurczewski, Barry T. Dale, Robert R. Atkinson, Jr., Stephen J. Allen, Patrick S. Johnson
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Publication number: 20150227174Abstract: In one embodiment chassis for an electronic device comprises a first section and a second section and an assembly to connect the first section of the chassis to the second section of the chassis for an electronic device, comprising a first hinge assembly to be coupled to the first section of the chassis for the electronic device, a second hinge assembly to be coupled to the second section of the chassis for the electronic device, a first rigid connecting member to be coupled to the first hinge assembly and the second hinge assembly, a first resistance element to provide a first rotational resistance between the first hinge assembly and a first end of the first rigid connecting member and a first resistance element to provide a second rotational resistance between the second hinge assembly and a second end of the first rigid connecting member. Other embodiments may be described.Type: ApplicationFiled: July 30, 2013Publication date: August 13, 2015Inventors: Tod A. Byquist, Peter Bristol, Michael S. Brazel, Kristin L. Weihl, Stella Latscha, Alexander D. Williams, Nicolas Kurczewski, Barry T. Dale, Robert R. Atkinson, JR., Stephen J. Allen, Patrick S. Johnson
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Patent number: 9086852Abstract: A computing device including fastening features. The computing device may include an upper shell comprising an upper boss protruding from the upper shell, the upper boss defining a cavity. The computing device may include a lower shell comprising a lower boss protruding from the lower shell. The computing device may include a threaded insert including an insert portion received at the cavity of the upper boss. The threaded insert may include a flange portion wider than the insert portion, and a lateral movement reduction feature. The computing device may include a fastener received through the lower boss and through the threaded insert to fasten the upper shell and lower shell to each other.Type: GrantFiled: December 21, 2012Date of Patent: July 21, 2015Assignee: Intel CorporationInventors: Patrick S. Johnson, Robert R. Atkinson, Jr., Tod A. Byquist, Ben M. Broili
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Publication number: 20140177152Abstract: A computing device including fastening features. The computing device may include an upper shell comprising an upper boss protruding from the upper shell, the upper boss defining a cavity. The computing device may include a lower shell comprising a lower boss protruding from the lower shell. The computing device may include a threaded insert including an insert portion received at the cavity of the upper boss. The threaded insert may include a flange portion wider than the insert portion, and a lateral movement reduction feature. The computing device may include a fastener received through the lower boss and through the threaded insert to fasten the upper shell and lower shell to each other.Type: ApplicationFiled: December 21, 2012Publication date: June 26, 2014Inventors: Patrick S. Johnson, Robert R. Atkinson, JR., Tod A. Byquist, Ben M. Broili
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Patent number: 7456170Abstract: Compounds of formula (I), or pharmaceutically acceptable derivatives thereof, wherein R represents H, C1-6 alkyl, SO2R1, SO2NR1R2, or COR1; R1 and R2 independently represent C1-6 alkyl; and Ring A represents a phenyl ring or a pyridinyl ring; may be useful in the treatment of anxiety, cardiovascular disease (including angina, atherosclerosis, hypertension, heart failure, edema, hypernatremia), dysmenorrhoea (primary and secondary), endometriosis, emesis (including motion sickness), intrauterine growth retardation, inflammation (including rheumatoid arthritis), mittlesmerchz, preclampsia, premature ejaculation, premature (preterm) labor and Raynaud's disease.Type: GrantFiled: August 12, 2005Date of Patent: November 25, 2008Assignee: Pfizer Inc.Inventor: Patrick S. Johnson
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Patent number: 7449462Abstract: Compounds of formula (I), or pharmaceutically acceptable derivatives thereof, wherein: Het represents 2-pyridinyl or 2-pyrimidinyl; R1 represents H, C1-3 alkyl or a nitrogen-containing heterocyclic ring having 5 or 6 ring atoms; R2 represents H, benzyl or C1-3 alkyl; and R3 represents H, methyl, methoxy or chloro; are useful for treating anxiety, cardiovascular disease (including angina, atherosclerosis, hypertension, heart failure, edema, hypernatremia), dysmenorrhoea (primary and secondary), endometriosis, emesis (motion sickness), intrauterine growth retardation, inflammation (including rheumatoid arthritis), mittlesmerchz, preclampsia, premature ejaculation, premature (preterm) labor and Raynaud's disease.Type: GrantFiled: January 11, 2005Date of Patent: November 11, 2008Assignee: Pfizer, Inc.Inventors: Justin S. Bryans, Patrick S. Johnson, Thomas Ryckmans, Alan Stobie
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Patent number: 6934155Abstract: A fastener assembly including a base consisting of a pair of motherboard snaps on a first end and a hollow shaft on a second end, the motherboard snaps to be inserted through an aperture of a motherboard. The hollow shaft is inserted through an aperture of a heat sink clip. The base further includes a pair of grooves on an exterior of the shaft. The assembly further including a cap consisting of a hollow interior, an integrated post attached to a base of the interior, and a pair of cantilever snaps. The cap is fitted over the exterior surface of the hollow shaft of the base to secure the clip between the base and the cap. The integrated post of the cap to be inserted into the hollow shaft of the base to deflect the motherboard snaps outward on an opposite side of the motherboard aperture to secure the assembly with the motherboard. The cantilever snaps to be positioned in the grooves of the shaft of the base to secure the cap with the base.Type: GrantFiled: June 11, 2003Date of Patent: August 23, 2005Assignee: Intel CorporationInventors: Russell S. Aoki, Daniel P. Carter, Patrick S. Johnson, Curtis J. Koepsell
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Publication number: 20040253077Abstract: An fastener assembly including a base consisting of a pair of motherboard snaps on a first end and a hollow shaft on a second end, the motherboard snaps to be inserted through an aperture of a motherboard. The hollow shaft is inserted through an aperture of a heat sink clip. The base further includes a pair of grooves on an exterior of the shaft. The assembly further including a cap consisting of a hollow interior, an integrated post attached to a base of the interior, and a pair of cantilever snaps. The cap is fitted over the exterior surface of the hollow shaft of the base to secure the clip between the base and the cap. The integrated post of the cap to be inserted into the hollow shaft of the base to deflect the motherboard snaps outward on an opposite side of the motherboard aperture to secure the assembly with the motherboard, and the cantilever snaps to be positioned in the grooves of the shaft of the base to secure the cap with the base.Type: ApplicationFiled: June 11, 2003Publication date: December 16, 2004Inventors: Russell S. Aoki, Daniel P. Carter, Patrick S. Johnson, Curtis J. Koepsell
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Patent number: 6547448Abstract: An embeddable fiber optic connector includes a small diameter protective sheath embedded within a plurality of composite layers of a composite structure. The sheath has a first end that is flush with a surface of the composite structure. An alignment sleeve is disposed within the sheath and an internal ferrule, mounted on an internal optical fiber, is snugly disposed within the alignment sleeve proximate a second end of the sheath. An external ferrule is mounted on an external optical fiber and is inserted into the first end of the sheath so as to be snugly disposed within the alignment sleeve proximate the internal ferrule, thereby establishing optical communications between the internal and external optical fibers. The external optical fiber is easily disconnected by gripping and removing the external ferrule from the connector. Reconnection is accomplished by reinserting the external ferrule into the connector.Type: GrantFiled: May 15, 2001Date of Patent: April 15, 2003Assignee: The Boeing CompanyInventors: Patrick S. Johnson, Dennis G. Koshinz
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Patent number: 6496372Abstract: The present invention relates to an electronic assembly that includes an integrated circuit package, a heat sink, and a fastener which connects the heat sink to the integrated circuit package to cool the integrated circuit package. The fastener includes a stem that extends through the heat sink and the integrated circuit package. The fastener further includes a clamp that is connected to one end of the stem and a spring head that is connected to an opposing end of the stem. The spring head includes a first biasing member that extends around the longitudinal axis of the stem to compress the heat sink and the integrated circuit package against the clamp in order to reduce the thermal impedance between the heat sink and the integrated circuit package.Type: GrantFiled: September 26, 2001Date of Patent: December 17, 2002Assignee: Intel CorporationInventors: Peter A. Davison, Lee M. Langseth, Patrick S. Johnson
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Publication number: 20020172470Abstract: An embeddable fiber optic connector includes a small diameter protective sheath embedded within a plurality of composite layers of a composite structure. The sheath has a first end that is flush with a surface of the composite structure. An alignment sleeve is disposed within the sheath and an internal ferrule, mounted on an internal optical fiber, is snugly disposed within the alignment sleeve proximate a second end of the sheath. An external ferrule is mounted on an external optical fiber and is inserted into the first end of the sheath so as to be snugly disposed within the alignment sleeve proximate the internal ferrule, thereby establishing optical communications between the internal and external optical fibers. The external optical fiber is easily disconnected by gripping and removing the external ferrule from the connector. Reconnection is accomplished by reinserting the external ferrule into the connector.Type: ApplicationFiled: May 15, 2001Publication date: November 21, 2002Applicant: The Boeing CompanyInventors: Patrick S. Johnson, Dennis G. Koshinz