Patents by Inventor Patrick Saitta

Patrick Saitta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240125730
    Abstract: The disclosed subject matter relates to techniques for methods and systems for non-reagent chloride analysis in an acid copper plating bath, using a blend of VMS (Virgin Makeup Solution) to generate Ag+-containing solution as a titration into a sample.
    Type: Application
    Filed: October 6, 2023
    Publication date: April 18, 2024
    Applicant: ECI TECHNOLOGY, INC.
    Inventors: Jingjing Wang, Patrick Saitta, Eugene Shalyt
  • Publication number: 20230280305
    Abstract: The present disclosure provides methods for determining concentration of various trace metal ions in aqueous solutions, such as gold plating solutions. At a particular fixed reduction potential, the cathodic current can suddenly increase in magnitude after a certain period of time (e.g., an incubation time) passes in the presence of a trace metal ion (e.g., Tl(I)), where the incubation time is inversely proportional to the concentration of trace metal in the electrolyte. The concentration of the trace metal can be calculated after measuring the incubation time and comparing it against a calibration curve.
    Type: Application
    Filed: January 5, 2023
    Publication date: September 7, 2023
    Applicant: ECI TECHNOLOGY, INC.
    Inventors: Patrick Saitta, Jingjing Wang, Eugene Shalyt
  • Publication number: 20230042975
    Abstract: Techniques for selective measurement and monitoring of boric acid concentrations in processing solutions are provided. Methods include the use of a complexing agent that reacts with hydrolyzing ions, for example, ethylenediaminetetraacetic (EDTA) acid salts in potentiometric titration. In such methods, a boric acid concentration in a processing solution can be accurately measured and monitored.
    Type: Application
    Filed: July 5, 2022
    Publication date: February 9, 2023
    Applicant: ECI Technology, Inc.
    Inventors: Jingjing Wang, Jong Woung Kim, Patrick Saitta, Eugene Shalyt