Patents by Inventor Patrick Schoengrundner

Patrick Schoengrundner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dual-interface IC card components and method for manufacturing the dual-interface IC card components
    Patent number: 9536188
    Abstract: Dual-interface Integrated Circuit (IC) card components and methods for manufacturing the dual-interface IC card components are described. In an embodiment, a dual-interface IC card component includes a single-sided contact base structure, which includes a substrate with an electrical contact layer. On the single-sided contact base structure, one or more antenna contact leads are attached to the single-sided contact base structure to form a dual-interface contact structure by applying an adhesive material to partially cover an overlapping area of the at least one antenna contact and the substrate, which is a component of a dual-interface IC card. Other embodiments are also described.
    Type: Grant
    Filed: April 2, 2015
    Date of Patent: January 3, 2017
    Assignee: NXP B.V.
    Inventors: Patrick Schoengrundner, Ernst Eiper, Christian Zenz
  • Dual interface IC card components and method for manufacturing the dual-interface IC card components
    Patent number: 9424507
    Abstract: Dual-interface Integrated Circuit (IC) card components and methods for manufacturing the dual-interface IC card components are described. In an embodiment, a dual-interface IC card component includes a single-sided contact base structure, which includes a substrate with an electrical contact layer. On the single-sided contact base structure, one or more antenna contact leads are attached to the single-sided contact base structure to form a dual-interface contact structure, which is a component of a dual-interface IC card. Other embodiments are also described.
    Type: Grant
    Filed: April 1, 2014
    Date of Patent: August 23, 2016
    Assignee: NXP B.V.
    Inventors: Christian Zenz, Tonny Kamphuis, Johannes Wilhelmus van Rijckevorsel, Bodin Kasemset, David Ceccarelli, Boudewijn van Blokland, Patrick Schoengrundner
  • DUAL-INTERFACE IC CARD COMPONENTS AND METHOD FOR MANUFACTURING THE DUAL-INTERFACE IC CARD COMPONENTS
    Publication number: 20150278674
    Abstract: Dual-interface Integrated Circuit (IC) card components and methods for manufacturing the dual-interface IC card components are described. In an embodiment, a dual-interface IC card component includes a single-sided contact base structure, which includes a substrate with an electrical contact layer. On the single-sided contact base structure, one or more antenna contact leads are attached to the single-sided contact base structure to form a dual-interface contact structure by applying an adhesive material to partially cover an overlapping area of the at least one antenna contact and the substrate, which is a component of a dual-interface IC card. Other embodiments are also described.
    Type: Application
    Filed: April 2, 2015
    Publication date: October 1, 2015
    Applicant: NXP B.V.
    Inventors: Patrick Schoengrundner, Ernst Eiper, Christian Zenz
  • DUAL INTERFACE IC CARD COMPONENTS AND METHOD FOR MANUFACTURING THE DUAL-INTERFACE IC CARD COMPONENTS
    Publication number: 20150278673
    Abstract: Dual-interface Integrated Circuit (IC) card components and methods for manufacturing the dual-interface IC card components are described. In an embodiment, a dual-interface IC card component includes a single-sided contact base structure, which includes a substrate with an electrical contact layer. On the single-sided contact base structure, one or more antenna contact leads are attached to the single-sided contact base structure to form a dual-interface contact structure, which is a component of a dual-interface IC card. Other embodiments are also described.
    Type: Application
    Filed: April 1, 2014
    Publication date: October 1, 2015
    Applicant: NXP B.V.
    Inventors: Christian Zenz, Tonny Kamphuis, Johannes Wilhelmus van Rijckevorsel, Bodin Kasemset, David Ceccarelli, Boudewijn van Blokland, Patrick Schoengrundner