Patents by Inventor Patrick Shipman
Patrick Shipman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11685808Abstract: A resin has a structure defined by Formula (I) wherein: (a) each R5 is independently a methylene group (CH2), or a methylene group substituted with one or more —H, —CH3, or halogen functionalities; (b) each R6 is independently a bond or a straight-chain or branched, linear or cyclic, saturated or unsaturated, substituted or unsubstituted, aliphatic or aromatic group having between 1 and 2 carbon atoms; (c) each X is independently a functionality possessing at least one non-aromatic alkene or alkyne moiety; (d) each Z is independently either H or X; (e) each Z is independently either H or X, and each p is independently an integer from 1-4; (f) each w is independently 0, or an integer greater than or equal to 1, and (i) when w is 0, the bracket region represents a bond and n is 0, or an integer greater than or equal to 1; and (ii) when n is 0, the bracket region represents a bond.Type: GrantFiled: December 29, 2020Date of Patent: June 27, 2023Assignee: NOVOSET, LLCInventors: Sajal Das, Paul Boothe, Patrick Shipman
-
Publication number: 20220411573Abstract: A resin has a structure defined by Formula (I) wherein: (a) each R5 is independently a methylene group (CH2), or a methylene group substituted with one or more —H, —CH3, or halogen functionalities; (b) each R6 is independently a bond or a straight-chain or branched, linear or cyclic, saturated or unsaturated, substituted or unsubstituted, aliphatic or aromatic group having between 1 and 2 carbon atoms; (c) each X is independently a functionality possessing at least one non-aromatic alkene or alkyne moiety; (d) each Z is independently either H or X; (e) each Z is independently either H or X, and each p is independently an integer from 1-4; (f) each w is independently 0, or an integer greater than or equal to 1, and (i) when w is 0, the bracket region represents a bond and n is 0, or an integer greater than or equal to 1; and (ii) when n is 0, the bracket region represents a bond.Type: ApplicationFiled: December 29, 2020Publication date: December 29, 2022Applicant: NOVOSET, LLCInventors: Sajal Das, Paul Boothe, Patrick Shipman
-
Patent number: 10781166Abstract: The present disclosure is directed to resins and to polymers, copolymers, and blends formed therefrom.Type: GrantFiled: March 1, 2019Date of Patent: September 22, 2020Assignee: 3D-Biomaterials, LLCInventors: Sajal Das, Patrick Shipman, Scott Shuler
-
Patent number: 10590066Abstract: The present disclosure is directed to resins and to polymers, copolymers, and blends formed therefrom.Type: GrantFiled: August 23, 2018Date of Patent: March 17, 2020Assignee: 3D-BIOMATERIALS, LLCInventors: Sajal Das, Patrick Shipman, Scott Shuler
-
Publication number: 20190241518Abstract: The present disclosure is directed to resins and to polymers, copolymers, and blends formed therefrom.Type: ApplicationFiled: March 27, 2019Publication date: August 8, 2019Inventors: Sajal Das, Paul Boothe, Patrick Shipman
-
Patent number: 10358418Abstract: The present disclosure is directed to resins and to polymers, copolymers, and blends formed therefrom.Type: GrantFiled: January 3, 2018Date of Patent: July 23, 2019Assignee: Novoset, LLCInventors: Sajal Das, Paul Boothe, Patrick Shipman
-
Publication number: 20190210967Abstract: The present disclosure is directed to resins and to polymers, copolymers, and blends formed therefrom.Type: ApplicationFiled: March 12, 2019Publication date: July 11, 2019Inventors: Sajal Das, Paul Boothe, Patrick Shipman, Scott Shuler
-
Publication number: 20190194123Abstract: The present disclosure is directed to resins and to polymers, copolymers, and blends formed therefrom.Type: ApplicationFiled: March 1, 2019Publication date: June 27, 2019Inventors: Sajal Das, Patrick Shipman, Scott Shuler
-
Publication number: 20190100489Abstract: The present disclosure is directed to resins and to polymers, copolymers, and blends formed therefrom.Type: ApplicationFiled: August 23, 2018Publication date: April 4, 2019Inventors: Sajal Das, Patrick Shipman, Scott Shuler
-
Publication number: 20180170873Abstract: The present disclosure is directed to resins and to polymers, copolymers, and blends formed therefrom.Type: ApplicationFiled: January 3, 2018Publication date: June 21, 2018Inventors: Sajal Das, Paul Boothe, Patrick Shipman
-
Patent number: 9902695Abstract: The present disclosure is directed to resins and to polymers, copolymers, and blends formed therefrom.Type: GrantFiled: May 22, 2017Date of Patent: February 27, 2018Assignee: NOVOSET LLCInventors: Sajal Das, Paul Boothe, Patrick Shipman
-
Patent number: 9873761Abstract: A thermosetting resin composition has particular applications in three dimensional (3-D) printing. The thermosetting resin composition exhibits high performance and is characterized by a high temperature two stage cure resin composition. The thermosetting resin composition comprises cyanate esters and other high temperature resins, photo curable monomers, photo initiator, metal catalyst or ionic liquid catalyst. The thermosetting resin composition cures at room temperature to form 3-D objects and upon further post cure these objects exhibit high temperature properties enabling use at temperatures exceeding 150 C.Type: GrantFiled: February 16, 2017Date of Patent: January 23, 2018Assignee: Novoset, LLCInventors: Sajal Das, Christopher N. Das, Patrick Shipman, Benjamin G. Baxter
-
Patent number: 9708440Abstract: A thermosetting resin composition has particular applications in three dimensional (3-D) printing. The thermosetting resin composition exhibits high performance and is characterized by a high temperature two stage cure resin composition. The thermosetting resin composition comprises cyanate esters and other high temperature resins, photo curable monomers, photo initiator, metal catalyst or ionic liquid catalyst. The thermosetting resin composition cures at room temperature to form 3-D objects and upon further post cure these objects exhibit high temperature properties enabling use at temperatures exceeding 150 C.Type: GrantFiled: October 30, 2015Date of Patent: July 18, 2017Assignee: NOVOSET, LLCInventors: Sajal Das, Christopher N. Das, Patrick Shipman, Benjamin G. Baxter
-
Patent number: 9596753Abstract: An ultra low loss dielectric thermosetting resin composition has at least one cyanate ester component (A) and at least one reactive intermediate component (B) that is capable of copolymerization with said component (A). The invention is a cyanate ester resin of the form: Tn-[W-(Z)f/(H)1?f-W]n?1-[W-(Z)f/(H)1?f-(OCN)f/(R)1?f]n+2, wherein T is a 1,3,5-substituted-triazine moiety (C3N3); W is a linking atom between triazine and either component A or component B; Z is component (A); H is component (B); OCN is a cyanate ester end group; R is a reactive end group of component B; n is an integer greater than or equal to 1; and f is a weight or mole fraction of component A. The composition exhibits excellent dielectric properties and yields a high performance laminate for use in high layer count, multilayer printed circuit board (PCB), prepregs, resin coated copper (RCC), film adhesives, high frequency radomes, radio frequency (RF) laminates and various composites.Type: GrantFiled: August 18, 2016Date of Patent: March 14, 2017Assignee: NOVOSET, LLCInventors: Sajal Das, Patrick Shipman
-
Publication number: 20160369040Abstract: A thermosetting resin composition has particular applications in three dimensional (3-D) printing. The thermosetting resin composition exhibits high performance and is characterized by a high temperature two stage cure resin composition. The thermosetting resin composition comprises cyanate esters and other high temperature resins, photo curable monomers, photo initiator, metal catalyst or ionic liquid catalyst. The thermosetting resin composition cures at room temperature to form 3-D objects and upon further post cure these objects exhibit high temperature properties enabling use at temperatures exceeding 150C.Type: ApplicationFiled: October 30, 2015Publication date: December 22, 2016Inventors: Sajal Das, Christopher N. Das, Patrick Shipman, Benjamin G. Baxter
-
Publication number: 20160360614Abstract: An ultra low loss dielectric thermosetting resin composition has at least one cyanate ester component (A) and at least one reactive intermediate component (B) that is capable of copolymerization with said component (A). The invention is a cyanate ester resin of the form: Tn-[W-(Z)f/(H)1-f-W]n?1-[W-(Z)f/(H)1-f-(OCN)f/(R)1-f]n+2, wherein T is a 1, 3, 5-substituted-triazine moiety (C3N3); W is a linking atom between triazine and either component A or component B; Z is component (A); H is component (B); OCN is a cyanate ester end group; R is a reactive end group of component B; n is an integer greater than or equal to 1; and f is a weight or mole fraction of component A. The composition exhibits excellent dielectric properties and yields a high performance laminate for use in high layer count, multilayer printed circuit board (PCB), prepregs, resin coated copper (RCC), film adhesives, high frequency radomes, radio frequency (RF) laminates and various composites.Type: ApplicationFiled: August 18, 2016Publication date: December 8, 2016Applicant: NOVOSET, LLCInventors: Sajal Das, Patrick Shipman
-
Patent number: 9439284Abstract: A ultra low loss dielectric thermosetting resin composition has at least one cyanate ester component (A) and at least one reactive intermediate component (B) that is capable of copolymerization with said component (A). The invention is a cyanate ester resin of the form: Tn-[W-(Z)f/(H)1?f-W]n?1-[W-(Z)f/(H)1?f-(OCN)f/(R)1?f]n+2, wherein T is a 1,3,5-substituted-triazine moiety (C3N3); W is a linking atom between triazine and either component A or component B; Z is component (A); H is component (B); OCN is a cyanate ester end group; R is a reactive end group of component B; n is an integer greater than or equal to 1; and f is a weight or mole fraction of component A. The composition exhibits excellent dielectric properties and yields a high performance laminate for use in high layer count, multilayer printed circuit board (PCB), prepregs, resin coated copper (RCC), film adhesives, high frequency radomes, radio frequency (RF) laminates and various composites.Type: GrantFiled: May 2, 2016Date of Patent: September 6, 2016Assignee: Novoset LLCInventors: Sajal Das, Patrick Shipman
-
Publication number: 20160249451Abstract: A ultra low loss dielectric thermosetting resin composition has at least one cyanate ester component (A) and at least one reactive intermediate component (B) that is capable of copolymerization with said component (A). The invention is a cyanate ester resin of the form: Tn-[W—(Z)f/(H)1-f—W]n?1—[W—(Z)f/(H)1-f—(OCN)f/(R)1-f]n+2, wherein T is a 1,3,5-substituted-triazine moiety (C3N3); W is a linking atom between triazine and either component A or component B; Z is component (A): H is component (B); OCN is a cyanate ester end group; R is a reactive end group of component B; n is an integer greater than or equal to 1; and f is a weight or mole fraction of component A. The composition exhibits excellent dielectric properties and yields a high performance laminate for use in high layer count, multilayer printed circuit board (PCB), prepregs, resin coated copper (RCC), film adhesives, high frequency radomes, radio frequency (RF) laminates and various composites.Type: ApplicationFiled: May 2, 2016Publication date: August 25, 2016Applicant: NOVOSET, LLCInventors: Sajal Das, Patrick Shipman
-
Patent number: 9332637Abstract: A ultra low loss dielectric thermosetting resin composition has at least one cyanate ester component (A) and at least one reactive intermediate component (B) that is capable of copolymerization with said component (A). The invention is a cyanate ester resin of the form: Tn-[W-(Z)f/(H)1?f-W]n?1-[W-(Z)f/(H)1?f-(OCN)f/(R)1?f]n+2, wherein T is a 1,3,5-substituted-triazine moiety (C3N3); W is a linking atom between triazine and either component A or component B; Z is component (A); H is component (B); OCN is a cyanate ester end group; R is a reactive end group of component B; n is an integer greater than or equal to 1; and f is a weight or mole fraction of component A. The composition exhibits excellent dielectric properties and yields a high performance laminate for use in high layer count, multilayer printed circuit board (PCB), prepregs, resin coated copper (RCC), film adhesives, high frequency radomes, radio frequency (RF) laminates and various composites.Type: GrantFiled: November 4, 2013Date of Patent: May 3, 2016Assignee: Novoset LLCInventors: Sajal Das, Patrick Shipman
-
Publication number: 20150126684Abstract: A ultra low loss dielectric thermosetting resin composition has at least one cyanate ester component (A) and at least one reactive intermediate component (B) that is capable of copolymerization with said component (A). The invention is a cyanate ester resin of the form: Tn-[W-(Z)f/(H)1?f-W]n?1-[W-(Z)f/(H)1?f-(OCN)f/(R)1?f]n+2, wherein T is a 1,3,5-substituted-triazine moiety (C3N3); W is a linking atom between triazine and either component A or component B; Z is component (A); H is component (B); OCN is a cyanate ester end group; R is a reactive end group of component B; n is an integer greater than or equal to 1; and f is a weight or mole fraction of component A. The composition exhibits excellent dielectric properties and yields a high performance laminate for use in high layer count, multilayer printed circuit board (PCB), prepregs, resin coated copper (RCC), film adhesives, high frequency radomes, radio frequency (RF) laminates and various composites.Type: ApplicationFiled: November 4, 2013Publication date: May 7, 2015Inventors: Sajal Das, Patrick Shipman