Patents by Inventor Patrick Simpkins

Patrick Simpkins has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Product setup sharing for multiple inspection systems
    Patent number: 8045788
    Abstract: An inspection tool includes a camera for obtaining images of a wafer and a controller configured for performing light source flat field correction, optical image warping correction, and optical image scale correction of the images. In operation, separate inspection tools are calibrated separately to obtain a characteristic response with respect to imaging and/or illumination for each such inspection tool. A standard target is then imaged by each inspection tool and the response of each of the inspection tools is normalized to ensure uniformity of the output of each inspection tool with respect to the other inspection tools.
    Type: Grant
    Filed: July 14, 2004
    Date of Patent: October 25, 2011
    Assignee: August Technology Corp.
    Inventors: Cory Watkins, Patrick Simpkins
  • Photoresist edge bead removal measurement
    Patent number: 7684611
    Abstract: An edge bead removal measurement method includes determining an edge of a wafer about a circumference of the wafer. A location of a wafer notch on the edge of the wafer is determined. A location of a center of the wafer is determined. A distance from the edge of the wafer to an edge bead removal line about the circumference of the wafer is determined.
    Type: Grant
    Filed: February 16, 2007
    Date of Patent: March 23, 2010
    Assignee: Rudolph Technologies, Inc.
    Inventor: Patrick Simpkins
  • Camera and illumination matching for inspection system
    Patent number: 7589783
    Abstract: An inspection tool includes a camera having a gain value and an offset value set to provide a first camera output indicating a first desired average gray value when the camera is illuminated with a precision light source set at a first light level. The inspection tool includes an inspection light source configured to be set at a second light level such that when the inspection light source illuminates a known target, the camera provides a second output indicating a second desired average gray value.
    Type: Grant
    Filed: July 14, 2004
    Date of Patent: September 15, 2009
    Assignee: Rudolph Technologies, Inc.
    Inventors: Patrick Simpkins, Cory Watkins
  • PHOTORESIST EDGE BEAD REMOVAL MEASUREMENT
    Publication number: 20080002877
    Abstract: An edge bead removal measurement method includes determining an edge of a wafer about a circumference of the wafer. A location of a wafer notch on the edge of the wafer is determined. A location of a center of the wafer is determined. A distance from the edge of the wafer to an edge bead removal line about the circumference of the wafer is determined.
    Type: Application
    Filed: February 16, 2007
    Publication date: January 3, 2008
    Inventor: Patrick Simpkins
  • Photoresist edge bead removal measurement
    Patent number: 7197178
    Abstract: An edge bead removal measurement method includes determining an edge of a wafer about a circumference of the wafer. A location of a wafer notch on the edge of the wafer is determined. A location of a center of the wafer is determined. A distance from the edge of the wafer to an edge bead removal line about the circumference of the wafer is determined.
    Type: Grant
    Filed: July 14, 2004
    Date of Patent: March 27, 2007
    Assignee: Rudolph Technologies, Inc.
    Inventor: Patrick Simpkins
  • Camera and illumination matching for inspection system
    Publication number: 20050052530
    Abstract: An inspection tool includes a camera having a gain value and an offset value set to provide a first camera output indicating a first desired average gray value when the camera is illuminated with a precision light source set at a first light level. The inspection tool includes an inspection light source configured to be set at a second light level such that when the inspection light source illuminates a known target, the camera provides a second output indicating a second desired average gray value.
    Type: Application
    Filed: July 14, 2004
    Publication date: March 10, 2005
    Inventors: Patrick Simpkins, Cory Watkins
  • Product setup sharing for multiple inspection systems
    Publication number: 20050041850
    Abstract: An inspection tool comprises a camera for obtaining images of a wafer and a controller configured for performing light source flat field correction, optical image warping correction, and optical image scale correction of the images.
    Type: Application
    Filed: July 14, 2004
    Publication date: February 24, 2005
    Inventors: Cory Watkins, Patrick Simpkins
  • Photoresist edge bead removal measurement
    Publication number: 20050013476
    Abstract: An edge bead removal measurement method includes determining an edge of a wafer about a circumference of the wafer. A location of a wafer notch on the edge of the wafer is determined. A location of a center of the wafer is determined. A distance from the edge of the wafer to an edge bead removal line about the circumference of the wafer is determined.
    Type: Application
    Filed: July 14, 2004
    Publication date: January 20, 2005
    Inventor: Patrick Simpkins