Abstract: Scanning systems may include a stator, a rotor supporting at least one radiation source and at least one radiation detector rotatable with the rotor, and a motivator operatively connected to the rotor. The stator, the rotor, the at least one radiation source, and the at least one radiation detector may be located within a housing. A conveyor system may extend through the housing and the rotor. A shielding system including a series of independently movable energy shields sized, shaped, and positioned to at least partially occlude a pathway along which the conveyor system extends may extend from an entrance to the housing, through the rotor, to an exit from the housing. A control system may be configured to cause the shielding system to automatically and dynamically move individual energy shields in response to advancement of one or more objects supported on the conveyor system.

Abstract: Scanning systems may include a stator, a rotor supporting at least one radiation source and at least one radiation detector rotatable with the rotor, and a motivator operatively connected to the rotor. The stator, the rotor, the at least one radiation source, and the at least one radiation detector may be located within a housing. A conveyor system may extend through the housing and the rotor. A shielding system including a series of independently movable energy shields sized, shaped, and positioned to at least partially occlude a pathway along which the conveyor system extends may extend from an entrance to the housing, through the rotor, to an exit from the housing. A control system may be configured to cause the shielding system to automatically and dynamically move individual energy shields in response to advancement of one or more objects supported on the conveyor system.

Abstract: Scanning systems may include a stator, a rotor supporting at least one radiation source and at least one radiation detector rotatable with the rotor, and a motivator operatively connected to the rotor. The stator, the rotor, the at least one radiation source, and the at least one radiation detector may be located within a housing. A conveyor system may extend through the housing and the rotor. A shielding system including a series of independently movable energy shields sized, shaped, and positioned to at least partially occlude a pathway along which the conveyor system extends may extend from an entrance to the housing, through the rotor, to an exit from the housing. A control system may be configured to cause the shielding system to automatically and dynamically move individual energy shields in response to advancement of one or more objects supported on the conveyor system.

Abstract: Scanning systems may include a stator, a rotor supporting at least one radiation source and at least one radiation detector rotatable with the rotor, and a motivator operatively connected to the rotor. The stator, the rotor, the at least one radiation source, and the at least one radiation detector may be located within a housing. A conveyor system may extend through the housing and the rotor. A shielding system including a series of independently movable energy shields sized, shaped, and positioned to at least partially occlude a pathway along which the conveyor system extends may extend from an entrance to the housing, through the rotor, to an exit from the housing. A control system may be configured to cause the shielding system to automatically and dynamically move individual energy shields in response to advancement of one or more objects supported on the conveyor system.

Abstract: An X-ray inspection system includes at least one display monitor and a console. The console includes at least two different visualization algorithms and a processor. The processor is configured to process volumetric image data with a first of the at least two different visualization algorithms and produce a first processed volumetric image. The processor is further configured to process the volumetric image data with a second of the at least two different visualization algorithms and produce a second processed volumetric image. The processor is further configured to concurrently display the first and second processed volumetric image data via the display monitor. The volumetric image data is indicative of a scanned object and items therein.

Abstract: One or more techniques and/or systems are described for generating power on a rotating unit of a system, such as a radiation system (e.g., CT system). The rotating unit comprises a generator that comprises a drive wheel. The drive wheel interfaces with a drive mechanism of a stationary unit. As the rotating unit is moved relative to the stationary unit, the drive wheel rotates along the drive mechanism causing power to be generated by the generator. The power may be supplied to one or more electronic components of the rotating unit.

Abstract: A transport apparatus of an X-ray inspection system includes an inspection region with an entrance and an exit. The transport apparatus further includes a loading region disposed at the entrance of the inspection region, the loading region. The loading region includes a first set of X-ray attenuating curtains and a first curtain mover, which moves the curtains of the first set of X-ray attenuating curtains into and out of the loading region between areas that support objects for inspection. The transport apparatus further includes a conveyor device which moves an object for inspection residing in one of the areas from the loading region to the inspection region for inspection.

Abstract: An X-ray inspection system includes at least one display monitor and a console. The console includes at least two different visualization algorithms and a processor. The processor is configured to process volumetric image data with a first of the at least two different visualization algorithms and produce first processed volumetric image. The processor is further configured to process the volumetric image data with a second of the at least two different visualization algorithms and produce second processed volumetric image. The processor is further configured to concurrently display the first and second processed volumetric image data via the display monitor. The volumetric image data is indicative of a scanned object and items therein.

Abstract: One or more techniques and/or systems are described for generating power on a rotating unit of a system, such as a radiation system (e.g., CT system). The rotating unit comprises a generator that comprises a drive wheel. The drive wheel interfaces with a drive mechanism of a stationary unit. As the rotating unit is moved relative to the stationary unit, the drive wheel rotates along the drive mechanism causing power to be generated by the generator. The power may be supplied to one or more electronic components of the rotating unit.

Abstract: A transport apparatus (114) of an X-ray inspection system (100) includes an inspection region (122) with an entrance (121) and an exit (123). The transport apparatus further includes a loading region (120) disposed at the entrance of the inspection region, the loading region. The loading region includes a first set of X-ray attenuating curtains (228, 230, 232, 234) and a first curtain mover (223), which moves the curtains of the first set of X-ray attenuating curtains into and out of the loading region between areas that support objects for inspection. The transport apparatus further includes a conveyor device (128) which moves an object for inspection residing in one of the areas from the loading region to the inspection region for inspection.

Abstract: A system and method are provided for implanting ions into a workpiece in a plurality of operating ranges. A desired dosage of ions is provided, and a spot ion beam is formed from an ion source and mass analyzed by a mass analyzer. Ions are implanted into the workpiece in one of a first mode and a second mode based on the desired dosage of ions, where in the first mode, the ion beam is scanned by a beam scanning system positioned downstream of the mass analyzer and parallelized by a parallelizer positioned downstream of the beam scanning system. In the first mode, the workpiece is scanned through the scanned ion beam in at least one dimension by a workpiece scanning system. In the second mode, the ion beam is passed through the beam scanning system and parallelizer un-scanned, and the workpiece is two-dimensionally scanned through the spot ion beam.

Abstract: A system and method are provided for implanting ions into a workpiece in a plurality of operating ranges. A desired dosage of ions is provided, and a spot ion beam is formed from an ion source and mass analyzed by a mass analyzer. Ions are implanted into the workpiece in one of a first mode and a second mode based on the desired dosage of ions, where in the first mode, the ion beam is scanned by a beam scanning system positioned downstream of the mass analyzer and parallelized by a parallelizer positioned downstream of the beam scanning system. In the first mode, the workpiece is scanned through the scanned ion beam in at least one dimension by a workpiece scanning system. In the second mode, the ion beam is passed through the beam scanning system and parallelizer un-scanned, and the workpiece is two-dimensionally scanned through the spot ion beam.

Abstract: A system and method are provided for implanting ions into a workpiece in a plurality of operating ranges. A desired dosage of ions is provided, and a spot ion beam is formed from an ion source and mass analyzed by a mass analyzer. Ions are implanted into the workpiece in one of a first mode and a second mode based on the desired dosage of ions, where in the first mode, the ion beam is scanned by a beam scanning system positioned downstream of the mass analyzer and parallelized by a parallelizer positioned downstream of the beam scanning system. In the first mode, the workpiece is scanned through the scanned ion beam in at least one dimension by a workpiece scanning system. In the second mode, the ion beam is passed through the beam scanning system and parallelizer un-scanned, and the workpiece is two-dimensionally scanned through the spot ion beam.

Abstract: A method derives a terminal return current or upstream current to adjust and/or compensate for variations in beam current during ion implantation. One or more individual upstream current measurements are obtained from a region of an ion implantation system. A terminal return current, or composite upstream current, is derived from the one or more current measurements. The terminal return current is then employed to adjust scanning or dose of an ion beam in order to facilitate beam current uniformity at a target wafer.

Abstract: The present invention is directed to a switch circuit and method to quickly enable or disable the ion beam to a wafer within an ion implantation system. The beam control technique may be applied to wafer doping repaint and duty factor reduction. The circuit and method may be used to quench an arc that may form between high voltage electrodes associated with an ion source to shorten the duration of the arc and mitigate non-uniform ion implantations. The circuit and method facilitates repainting the ion beam over areas where an arc was detected to recover dose loss during such arcing. A high voltage high speed switching circuit is added between each high voltage supply and its respective electrode to quickly extinguish the arc to minimize disruption of the ion beam. The high voltage switch is controlled by a trigger circuit which detects voltage or current changes to each electrode. Protection circuits for the HV switch absorb energy from reactive components and clamp any overvoltages.

Abstract: A parallelizing component of an ion implantation system comprises two angled dipole magnets that mirror one another and serve to bend an ion beam traversing therethrough to have a substantially “s” shape. This s bend serves to filter out contaminants of the beam, while the dipoles also parallelize the beam to facilitate uniform implant properties across the wafer, such as implant angle, for example. Additionally, a deceleration stage is included toward the end of the implantation system so that the energy of the beam can be kept relatively high throughout the beamline to mitigate beam blowup.

Abstract: A system and method are provided for implanting ions into a workpiece in a plurality of operating ranges. A desired dosage of ions is provided, and a spot ion beam is formed from an ion source and mass analyzed by a mass analyzer. Ions are implanted into the workpiece in one of a first mode and a second mode based on the desired dosage of ions, where in the first mode, the ion beam is scanned by a beam scanning system positioned downstream of the mass analyzer and parallelized by a parallelizer positioned downstream of the beam scanning system. In the first mode, the workpiece is scanned through the scanned ion beam in at least one dimension by a workpiece scanning system. In the second mode, the ion beam is passed through the beam scanning system and parallelizer un-scanned, and the workpiece is two-dimensionally scanned through the spot ion beam.

Abstract: A parallelizing component of an ion implantation system comprises two angled dipole magnets that mirror one another and serve to bend an ion beam traversing therethrough to have a substantially “s” shape. This s bend serves to filter out contaminants of the beam, while the dipoles also parallelize the beam to facilitate uniform implant properties across the wafer, such as implant angle, for example. Additionally, a deceleration stage is included toward the end of the implantation system so that the energy of the beam can be kept relatively high throughout the beamline to mitigate beam blowup.

Abstract: The present invention is directed to a switch circuit and method to quickly enable or disable the ion beam to a wafer within an ion implantation system. The beam control technique may be applied to wafer doping repaint and duty factor reduction. The circuit and method may be used to quench an arc that may form between high voltage electrodes associated with an ion source to shorten the duration of the arc and mitigate non-uniform ion implantations. The circuit and method facilitates repainting the ion beam over areas where an arc was detected to recover dose loss during such arcing. A high voltage high speed switching circuit is added between each high voltage supply and its respective electrode to quickly extinguish the arc to minimize disruption of the ion beam. The high voltage switch is controlled by a trigger circuit which detects voltage or current changes to each electrode. Protection circuits for the HV switch absorb energy from reactive components and clamp any overvoltages.

Abstract: A method derives a terminal return current or upstream current to adjust and/or compensate for variations in beam current during ion implantation. One or more individual upstream current measurements are obtained from a region of an ion implantation system. A terminal return current, or composite upstream current, is derived from the one or more current measurements. The terminal return current is then employed to adjust scanning or dose of an ion beam in order to facilitate beam current uniformity at a target wafer.