Abstract: An integrated circuit chip has on-chip millimeter wave (mmW) circuitry. An on-chip electro static discharge, ESD, protection network couples a signal pad of the chip to the mmW circuitry. The ESD protection network has a shorted stub being a low impedance path to ground for ESD events. Other embodiments are also described and claimed.

Abstract: A coaxial-based communication system connects network-side xDSL services to xDSL CPE devices and avoids interference from a noise spectrum that is degrading to xDSL performance or emission compliance on either the network or customer premises sides on the NID. The system provides an NID and a CPE interface device at the two ends of the coaxial wiring to perform a spectral relocation of the xDSL signal to a lower noise frequency band than is used for the xDSL service. Interfaces to the system are industry standard xDSL, POTS, and CATV services, while the transport medium is the normal coaxial type wiring and CATV splitters found on the customer premise.