Abstract: A microelectrode array including a top portion, a plurality of pads positioned on the top portion, and a shank portion, the shank portion including a titanium substrate, a dielectric structure positioned on the titanium substrate, and a metallization layer embedded in the dielectric structure, the metallization layer including a plurality of electrode sites distributed longitudinally along the shank portion, and a plurality of electrical traces, wherein the dielectric structure provides an access window over each of the plurality of the electrode sites and each of the plurality of electrical traces electrically connects a corresponding electrode site of the plurality of electrode sites to a corresponding pad of the plurality of pads.