Patents by Inventor Patrick W. Chye

Patrick W. Chye has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for reducing oxygen precipitation in silicon wafers
    Patent number: 4432809
    Abstract: The rate of oxygen precipitation in a semiconductor wafer during heat treatment is reduced by quickly inserting the wafer into a furnace which has been preheated to the heat treatment temperature. After performing the heat treatment, the wafer is slowly cooled to prevent warpage or cracking.
    Type: Grant
    Filed: March 10, 1982
    Date of Patent: February 21, 1984
    Assignee: International Business Machines Corporation
    Inventors: Patrick W. Chye, Eric W. Hearn, Murlidhar V. Kulkarni, Gary Markovits