Patents by Inventor Patrick W. Lam

Patrick W. Lam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adducts of an hydroxy-free acrylate resin and an epoxy resin
    Patent number: 5026794
    Abstract: This invention provides an adduct of an epoxy resin and a hydroxy free acrylate resin. The novel adduct contains vinyl unsaturation and hence may be copolymerized with an ethylenically unsaturated monomer to provide a tough thermoset resin.
    Type: Grant
    Filed: May 23, 1989
    Date of Patent: June 25, 1991
    Assignee: Polysar Limited
    Inventors: Kam W. Ho, Patrick W. Lam
  • Fortified polyacrylate resins
    Patent number: 4980406
    Abstract: The present invention relates to thermosetting polyacrylate compositions having surprising impact strength and glass transition temperature properties.The compositions are prepared with a selected acrylate monomer, a copolymerizable unsaturated monomer, and a selected nitrile rubber and are cured with a free radical curing agent.The compositions are suitable for use in molding compounds.
    Type: Grant
    Filed: July 22, 1988
    Date of Patent: December 25, 1990
    Assignee: Polysar Limited
    Inventor: Patrick W. Lam