Patents by Inventor Patrick Wayne Sadik

Patrick Wayne Sadik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate etch
    Patent number: 9988263
    Abstract: An example provides a method including sputtering a metal catalyst onto a substrate, exposing the substrate to a solution that reacts with the metal catalyst to form a plurality of pores in the substrate, and etching the substrate to remove the plurality of pores to form a recess in the substrate.
    Type: Grant
    Filed: August 30, 2013
    Date of Patent: June 5, 2018
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Patrick Wayne Sadik, Roger A. McKay
  • Substrate Etch
    Publication number: 20160208404
    Abstract: An example provides a method including sputtering a metal catalyst onto a substrate, exposing the substrate to a solution that reacts with the metal catalyst to form a plurality of pores in the substrate, and etching the substrate to remove the plurality of pores to form a recess in the substrate.
    Type: Application
    Filed: August 30, 2013
    Publication date: July 21, 2016
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Patrick Wayne Sadik, Roger A. McKay Jr
  • Substrate Etch
    Publication number: 20160200568
    Abstract: An example provides a method including sputtering a metal catalyst onto a substrate, exposing the substrate to a solution that reacts with the metal catalyst to form a plurality of pores in the substrate, and etching the substrate to remove the plurality of pores to form a recess in the substrate.
    Type: Application
    Filed: August 30, 2013
    Publication date: July 14, 2016
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Patrick Wayne Sadik, Roger A. McKay